Effect of CeO2 Modified MAS Middle Layer on the Joint of C/C-LAS
Source abstract
Abstract
采用稀土CeO 2 改性镁铝硅玻璃(MAS)作为中间层, 对碳/碳(C/C)复合材料和锂铝硅玻璃陶瓷(LAS)进行热压连接, 研究了稀土氧化物CeO 2 的掺杂对连接接头性能的影响。利用扫描电子显微镜(SEM)、能谱(EDS)对稀土改性的MAS中间层、连接界面的形貌及成分进行分析, 利用万能试验机测试C/C-LAS连接接头的剪切强度。研究结果表明: 与未添加CeO 2 改性的MAS中间层相比较, 改性后MAS中间层表面较致密, 孔洞缺陷少, MAS中间层的厚度约为150 μm, 未改性MAS中间层的厚度为50 μm; 稀土CeO 2 改性后的连接接头平均剪切强度为25.37 MPa, 比未改性的连接接头强度提高约为30%。
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Research context
OpenAlex topics: Integrated Circuits and Semiconductor Failure Analysis · Semiconductor materials and devices · Semiconductor materials and interfaces
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