DataVXJournal of Information DisplayPaper
journal article·2001-12Open access

Vacuum Packaging Technology of AC-PDP using Direct-Joint Method

Duck-Jung Lee, Yun-Hi Lee, Gwon-Jin Moon, Jun-Dong Kim, Won-Do Choi, Sang-Geun Lee, Jin Jang, Byeong-Kwon Ju

Journal of Information Display· Volume 2· Issue 4
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Source abstract

Abstract

AbstractWe suggested new PDP packaging technology using the direct joint method, which does not need an exhausting hole and tube. The advantages of this method are simple process, short process time and time panel package. To packaging, we drew the seal line of glass frit by dispenser followed by forming the lump, which provide pumping-out path during the packaging process. And, we have performed a pretreatment of glass frit to reduce the out-gases. After which, both front and rear glass plates were aligned and loaded into vacuum packaging chamber. The 4-inch monochrome AC-PDP was successfully packaged and fully emitted with brightness of 1000 cd/m2. Also, glass frit properties for pretreatment condition was investigated by AES and SEM analyses.
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Research context

Ceramics & glasses

OpenAlex topics: High voltage insulation and dielectric phenomena · Copper Interconnects and Reliability · Engineering Applied Research

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Affiliations

a Electronic Materials and Devices Research Center , KIST P.O. Box 131, Cheongryang, Seoul , 130–650 , Korea Phone: Fax: E-mail:

b Orion electric Co. LTD. , RandD Lab. 257 Gongdan-Dong, Gumi, Kyug-Buk , Korea

c Semiconductor electronic components and electric industry division , Ministry of Commerce, Industry and Energy , Seoul , Korea

d Agency for Technology and Standards , MOICE Electric standards divisions , Seoul , Korea

e Department of Physics , Kyunghee University , Seoul , Korea

References

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