Carbon black pastes as coatings for improving thermal gap-filling materials
Source abstract
Abstract
Carbon black pastes were found to be effective as coatings for improving the performance of thermal gap-filling materials, including flexible graphite, aluminum and copper. The thermal contact conductance across copper mating surfaces was increased by up to 180%. A fluidic form of carbon black paste (based on polyethylene glycol) was more effective than a thixotropic form (based on polyol esters). The carbon black pastes were much more effective as coatings than a commercial silver paste. With a carbon black paste coating, aluminum foil (7 μm thick) was a superior gap-filling material compared to similarly coated flexible graphite (130 μm thick). However, without a coating, flexible graphite was superior to aluminum. Commercial silicone-based gap-filling materials were inferior to flexible graphite or aluminum (whether coated or not).
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Thermal properties of materials · Electronic Packaging and Soldering Technologies · Advanced ceramic materials synthesis
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (20)
Show source-provided references
1. Prediction of thermal contact resistance between polished surfaces10.1016/S0017-9310(98)00067-2 ↗
2. Ouellette T, de Sorgo M. Thermal performance of heat transfer interface materials. In: Proceedings of the power electronics design conference, power sources users conference, Cerritos, CA, 1985, p. 134–8.
3. Thermal performance for a miniature heat sink cooled by microPCM slurry
4. Enhancement of thermal contact conductance for electronic systems10.1016/S1359-4311(00)00034-X ↗
5. The effect of thermal contact resistance on heat management in the electronic packaging10.1016/j.apsusc.2004.11.030 ↗
6. Thermally conductive adhesives for high thermally stressed assembly
7. Silicones with improved thermal conductivity for thermal management in electronic packaging
8. Moisture-absorption, dielectric relaxation, and thermal conductivity studies of polymer composites10.1002/(SICI)1099-0488(19980930)36:13<2259::AID-POLB2>3.0.CO;2-O ↗
9. Development of sheet type thermal conductive compound using AlN
10. Lithium doped polyethylene-glycol-based thermal interface pastes for high thermal contact conductance10.1115/1.1477191 ↗
11. Sodium silicate based thermal pastes for high thermal contact conductance10.1115/1.483144 ↗
12. Carbon black dispersions and carbon–silver combinations as thermal pastes that surpass commercial silver and ceramic pastes in providing high thermal contact conductance10.1016/j.carbon.2004.05.013 ↗
13. Carbon black dispersions as thermal pastes that surpass solder in providing high thermal contact conductance10.1016/S0008-6223(03)00247-1 ↗
14. Leong, C-K, Aoyagi Y, Chung DDL, Carbon-black thixotropic thermal pastes for improving thermal contacts. J Electron Mater, in press.10.1007/s11664-005-0259-2 ↗
15. Thermal interface properties of Cu-filled vertically aligned carbon nanofiber arrays10.1021/nl048506t ↗
16. Electronic applications of flexible graphite10.1007/s11664-002-0111-x ↗
17. Thermal joint conductance for flexible graphite materials: analytical and experimental study10.1109/TCAPT.2004.843153 ↗
18. Flexible graphite under repeated compression studied by electrical resistance measurements10.1016/S0008-6223(00)00213-X ↗
19. Flexible graphite for gasketing, adsorption, electromagnetic interference shielding, vibration damping, electrochemical applications, and stress sensing10.1361/105994900770346105 ↗
20. Exfoliation of graphite10.1007/BF01132008 ↗