Thin and hermetic packaging process for flat panel display application

Abstract This paper presents a study on the tubeless Plasma Display Panel (PDP) packaging using glass‐to‐glass electrostatic bonding with intermediate amorphous silicon. The bonded sample sealing the mixed gas with three species showed high strength ranging from 2.5 MPa to 4 MPa. The glass‐to‐glass bonding for packaging was performed at a low temperature of 180 °C by applying bias of 250 V dc in ambient of mixed gases of He‐Ne(27 %)‐Xe(3 %). The tubeless packaging was accomplished by bonding the support glass plate of 30 mm×50 mm on the rear glass panel and the capping glass of 20 mm×20 mm. The 4‐inch color AC‐PDP with thickness of 8 mm was successfully fabricated and fully emitted as white color at a firing voltage of 190V.