The thermal reliability of indium-doped low solver SAC/Cu joints and the corresponding alloys
Source abstract
Abstract
Based on CALPHAD-guided alloy design, key experimental investigations, and first-principles calculations, this study explores the melting characteristics, microstructure, mechanical properties, and fracture mechanisms of Sn-0.5Ag-0.7Cu-3Bi-xIn (x = 4, 8, 12, 17, wt.%)/Cu solder joints. Research reveals that In doping lowers the solidus, liquidus, and peak temperatures, while increasing the melting range and undercooling. The matrix phases of 4In and 8In solders are β-Sn. When the In content exceeds 12 wt.%, the γ-InSn4 phase starts to appear in the matrix, the matrix is transforming from the original single-phase into a dual-phase matrix. Consistent with it, the interfacial compound phase also has In doped, forming Cu6(Sn, In)5. During isothermal aging at 170 °C for 0–750 h, In doped less than 12 wt.% inhibits the growth of Cu3(In,Sn) and Cu6(Sn,In)5, while the joints with just 12 wt.% In doping exhibit the strongest inhibition effect on the interface IMCs. After 750 h of aging, the 12In/Cu solder joint shows the best mechanical properties, with high shear strength and shear energy, minimal displacement damage, and consistent ductile fracture mode before and after aging. The nanoindentation results indicate that the hardness of the IMC layer remains nearly unchanged, and the modulus increases, along with an increase in Ei/H values and plasticity with increasing In content. These results are mainly due to the larger charge density difference between Cu and In atoms compared to those between Cu and Sn atoms, indicating a stronger Cu–In bond compared to the Cu–Sn bond. Because Young’s modulus is an intrinsic property, its magnitude may be related to the strength of bonding in the structure. This study, guided by CALPHAD for phase types and fractions, correlates nanoindentation with changes in mechanical properties and microstructure, and validates material performance through first-principles calculations. It has practical significance for controlling the growth of interface compounds, exploring the impact of the In element doping on solder joint performance, and stabilizing solder joint structures.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Semiconductor materials and devices · 3D IC and TSV technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (71)
Show source-provided references
1. Zhang L, Han J, He C, Guo Y (2012) Reliability behavior of lead-free solder joints in electronic components. J Mater Sci: Mater Electron 24:172–190. https://doi.org/10.1007/s10854-012-0720-y10.1007/s10854-012-0720-y ↗
2. Jiang N, Zhang L, Liu ZQ, Sun L, Long WM, He P, Xiong MY, Zhao M (2019) Reliability issues of lead-free solder joints in electronic devices. Sci Technol Adv Mater 20:876–901. https://doi.org/10.1080/14686996.2019.164007210.1080/14686996.2019.1640072 ↗
3. El-Daly AA, El-Taher AM, Gouda S (2015) Novel Bi-containing Sn–1.5Ag–0.7Cu lead-free solder alloy with further enhanced thermal property and strength for mobile products. Mater Des (1980-2015) 65:796–805. https://doi.org/10.1016/j.matdes.2014.10.00610.1016/j.matdes.2014.10.006 ↗
4. Xiong M, Zhang L (2018) Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging. J Mater Sci 54:1741–1768. https://doi.org/10.1007/s10853-018-2907-y10.1007/s10853-018-2907-y ↗
5. Collins MN, Dalton E, Punch J (2016) Microstructural influences on thermomechanical fatigue behaviour of third generation high Ag content Pb-Free solder alloys. J Alloys Compd 688:164–170. https://doi.org/10.1016/j.jallcom.2016.07.19110.1016/j.jallcom.2016.07.191 ↗
6. Li H, An R, Wang C, Li B (2015) Suppression of void nucleation in Sn3.0Ag0.5Cu/CU solder joint by rapid thermal processing. Mater Lett 158:252–254. https://doi.org/10.1016/j.matlet.2015.05.13210.1016/j.matlet.2015.05.132 ↗
7. Miller CM, Anderson IE, Smith JF (1994) A viable tin-lead solder substitute: Sn-Ag-Cu. J Electron Mater 23:595–601. https://doi.org/10.1007/bf0265334410.1007/bf02653344 ↗
8. Yang M, Ji H, Wang S, Ko Y-H, Lee C-W, Wu J, Li M (2016) Effects of Ag content on the interfacial reactions between liquid Sn–Ag–Cu solders and Cu substrates during soldering. J Alloys Compd 679:18–25. https://doi.org/10.1016/j.jallcom.2016.03.17710.1016/j.jallcom.2016.03.177 ↗
9. Shnawah DA, Sabri MFM, Badruddin IA (2012) A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products. Microelectron Reliab 52:90–99. https://doi.org/10.1016/j.microrel.2011.07.09310.1016/j.microrel.2011.07.093 ↗
10. Li Y, Long W, Hu X, Fu Y (2018) Interfacial reaction and IMC growth of an ultrasonically soldered Cu/SAC305/cu structure during isothermal aging. Mater (Basel) 11:84. https://doi.org/10.3390/ma1101008410.3390/ma11010084 ↗
11. Mustafa M, Suhling JC, Lall P (2016) Experimental determination of fatigue behavior of lead free solder joints in microelectronic packaging subjected to isothermal aging. Microelectron Reliab 56:136–147. https://doi.org/10.1016/j.microrel.2015.10.02110.1016/j.microrel.2015.10.021 ↗
12. Shnawah DA, Said SBM, Sabri MFM, Badruddin IA, Che FX (2012) High-reliability low-Ag-content Sn-Ag-Cu solder joints for electronics applications. J Electron Mater 41:2631–2658. https://doi.org/10.1007/s11664-012-2145-z10.1007/s11664-012-2145-z ↗
13. Suh D, Kim DW, Liu P, Kim H, Weninger JA, Kumar CM, Prasad A, Grimsley BW, Tejada HB (2007) Effects of Ag content on fracture resistance of Sn–Ag–Cu lead-free solders under high-strain rate conditions. Mater Sci Eng A 460–461:595–603. https://doi.org/10.1016/j.msea.2007.01.14510.1016/j.msea.2007.01.145 ↗
14. Hammad AE (2013) Evolution of microstructure, thermal and creep properties of Ni-doped Sn–0.5Ag–0.7Cu low-Ag solder alloys for electronic applications. Mater Des (1980-2015) 52:663–670. https://doi.org/10.1016/j.matdes.2013.05.10210.1016/j.matdes.2013.05.102 ↗
15. Celikin M, Maalekian M, Pekguleryuz M (2018) Effect of Bi additions on the creep behaviour of SAC solder alloys. J Electron Mater 47:5842–5849. https://doi.org/10.1007/s11664-018-6458-410.1007/s11664-018-6458-4 ↗
16. Gu Y, Zhao X, Li Y, Liu Y, Wang Y, Li Z (2015) Effect of nano-Fe2O3 additions on wettability and interfacial intermetallic growth of low-Ag content Sn–Ag–Cu solders on Cu substrates. J Alloys Compd 627:39–47. https://doi.org/10.1016/j.jallcom.2014.12.02410.1016/j.jallcom.2014.12.024 ↗
17. Yang M, Ko Y-H, Bang J, Kim T-S, Lee C-W, Li M (2017) Effects of Ag addition on solid–state interfacial reactions between Sn–Ag–Cu solder and Cu substrate. Mater 124:250–259. https://doi.org/10.1016/j.matchar.2017.01.00410.1016/j.matchar.2017.01.004 ↗
18. Jeong S, Jang J-W, Yoo S, Park J, Cho S, Han J, An S (2017) Metallurgical behaviors of lead-free solder alloys with respect to Ag content in a ball grid array package around melting temperatures. J Mater Sci: Mater Electron 28:17038–17043. https://doi.org/10.1007/s10854-017-7628-510.1007/s10854-017-7628-5 ↗
19. Phukaoluan A, Srirussamee K, Khantachawana A, Chuchonak M, Tunthawiroon P (2024) Influence of the oxide film on the performance and corrosion resistance of TiNiCu shape memory alloys as the heat engine actuator. Eng Sci 31:1226. https://doi.org/10.30919/es122610.30919/es1226 ↗
20. Battaglia M, Sellitto A, Acanfora V, Zarrelli M, Riccio A (2024) Structural numerical simulations on shape memory alloys based actuators. Eng Sci. https://doi.org/10.30919/es133710.30919/es1337 ↗
21. Yan J, Wei H, Xie H, Gu X, Bao H (2020) Seeking for low thermal conductivity atomic configurations in SiGe alloys with bayesian optimization. ESEE 8:56–64. https://doi.org/10.30919/esee8c35610.30919/esee8c356 ↗
22. Mulky L, Rao PJEM, Manufacturing (2023) Effect of operational parameters on fouling of 6061 aluminum alloy under dynamic conditions. ES Mater Manuf 21:893. https://doi.org/10.30919/esmm89310.30919/esmm893 ↗
23. Al-Mousawi M, Shafaie S, Khulief Z (2023) Influence of process parameters on surface crack density in electrical discharge machining of Ni35Ti35Zr15Cu10Sn5 shape memory alloy. ES Mater Manuf 23:1013. https://doi.org/10.30919/esmm101310.30919/esmm1013 ↗
24. Hindi J, Murthy A, Muralishwara K, Kasip K, Gurumurthy B, Naik NJEM, Manufacturing (2023) Tribological characterization of precipitation hardened 7075 aluminium alloy composites reinforced with cast iron particle. ES Mater Manuf 22:1034. https://doi.org/10.30919/esmm103410.30919/esmm1034 ↗
25. Shetty T, Naik N, Samrot AV, Bhat P, Salmataj SJEM, Manufacturing (2023) Protection of magnesium AZ31B alloy in a hydrochloric acid medium using gelatin and optimizing the results through response surface methodology. ES Mater Manuf 22:1066. https://doi.org/10.30919/esmm106610.30919/esmm1066 ↗
26. Zykova A, Vorontsov A, Chumaevskii A, Gurianov D, Savchenko N, Kolubaev E, Tarasov SJEM, Manufacturing (2024) ES Materials & Manufacturing Microstructures and characterization of Ti6Al4V alloy friction stir alloyed with Cu and Al powders. ES Mater Manuf 25:1205. https://doi.org/10.30919/esmm120510.30919/esmm1205 ↗
27. Wang J, Xue S, Zhang P, Zhai P, Tao Y (2019) The reliability of lead-free solder joint subjected to special environment: a review. J Mater Sci: Mater Electron 30:9065–9086. https://doi.org/10.1007/s10854-019-01333-w10.1007/s10854-019-01333-w ↗
28. Yang L, Zhang Y, Dai J, Jing Y, Ge J, Zhang N (2015) Microstructure, interfacial IMC and mechanical properties of Sn–0.7Cu–xAl (x=0–0.075) lead-free solder alloy. Mater Des 67:209–216. https://doi.org/10.1016/j.matdes.2014.11.03610.1016/j.matdes.2014.11.036 ↗
29. Lai Y, Hu X, Li Y, Jiang X (2018) Interfacial microstructure evolution and shear strength of Sn0.7Cu–xNi/Cu solder joints. J Mater Sci: Mater Electron 29:11314–11324. https://doi.org/10.1007/s10854-018-9219-510.1007/s10854-018-9219-5 ↗
30. Li Q, Li C, Wang X, Cai S, Peng J, Chen S, Wang J, Yuan X (2024) Microstructure and shear properties evolution of minor Fe-doped SAC/Cu substrate solder joint under isothermal aging. Acta Metall Sin (Engl Lett) 37:1279–1290. https://doi.org/10.1007/s40195-024-01691-310.1007/s40195-024-01691-3 ↗
31. Wang Q, Cai S, Yang S, Yu Y, Wan Y, Peng J, Wang J, Wang X (2024) Comparison of high-speed shear properties of low-temperature Sn-Bi/Cu and Sn-In/Cu solder joints. J Mater Sci: Mater Electron 35:576. https://doi.org/10.1007/s10854-024-12302-310.1007/s10854-024-12302-3 ↗
32. Yang T, Chen Y, You K, Dong Z, Jia Y, Wang G, Peng J, Cai S, Luo X, Liu C, Wang J (2022) Effect of Bi, Sb, and Ti on microstructure and mechanical properties of SAC105 alloys. Materials 15:4727. https://doi.org/10.3390/ma1514472710.3390/ma15144727 ↗
33. Zhang J, Zhao Y, Wang X, Cai S, Peng J, Liu C, Kallel M, El-Bahy ZM, Wang S, Liu B (2024) Microstructures and shear properties of antimony-and indium-strengthened Sn5Bi/Cu joints. Adv Compos Hybrid Mater 7:78. https://doi.org/10.1007/s42114-024-00889-410.1007/s42114-024-00889-4 ↗
34. Wang X, Zhang S, Zhang J, Cai S, Liu N, Wang YL (2024) A synchronous improvement of strength and elongation caused by solid solution in low-silver SAC solder with superior necking resistance properties. J Mater Res Technol 33:6397–6407. https://doi.org/10.1016/j.jmrt.2024.10.20810.1016/j.jmrt.2024.10.208 ↗
35. Wu J, Huang G-Q, Xue S-B, Xue P, Xu Y (2022) Thermal reliabilities of Sn-0.5Ag-0.7Cu-0.1Al2O3/Cu solder joint. Trans Nonferrous Met Soc China 32:3312–3320. https://doi.org/10.1016/s1003-6326(22)66022-910.1016/s1003-6326(22)66022-9 ↗
36. Wen Y, Zhao X, Chen Z, Gu Y, Wang Y, Chen Z, Wang X (2017) Reliability enhancement of Sn-1.0Ag-0.5Cu nano-composite solders by adding multiple sizes of TiO2 nanoparticles. J Alloys Compd 696:799–807. https://doi.org/10.1016/j.jallcom.2016.12.03710.1016/j.jallcom.2016.12.037 ↗
37. El-Daly AA, Fawzy A, Mansour SF, Younis MJ (2013) Novel SiC nanoparticles-containing Sn–1.0Ag–0.5Cu solder with good drop impact performance. Mater Sci Eng A 578:62–71. https://doi.org/10.1016/j.msea.2013.04.02210.1016/j.msea.2013.04.022 ↗
38. Chantaramanee S, Sungkhaphaitoon P (2021) Influence of bismuth on microstructure, thermal properties, mechanical performance, and interfacial behavior of SAC305-xBi/Cu solder joints. Trans Nonferrous Met Soc China 31:1397–1410. https://doi.org/10.1016/s1003-6326(21)65585-110.1016/s1003-6326(21)65585-1 ↗
39. Liu Y, Sun F, Liu Y, Li X (2014) Effect of Ni, Bi concentration on the microstructure and shear behavior of low-Ag SAC–Bi–Ni/Cu solder joints. J Mater Sci: Mater Electron 25:2627–2633. https://doi.org/10.1007/s10854-014-1921-310.1007/s10854-014-1921-3 ↗
40. Kanlayasiri K, Mongkolwongrojn M, Ariga T (2009) Influence of indium addition on characteristics of Sn–0.3Ag–0.7Cu solder alloy. J Alloys Compd 485:225–230. https://doi.org/10.1016/j.jallcom.2009.06.02010.1016/j.jallcom.2009.06.020 ↗
41. Hu X, Lai Y, Jiang X, Li Y (2018) Effects of In addition on the wettability, interfacial characterization and properties of ternary Sn–Cu–Ni solders. J Mater Sci: Mater Electron 29:18840–18851. https://doi.org/10.1007/s10854-018-0009-x10.1007/s10854-018-0009-x ↗
42. Luo X, Peng J, Zhang W, Wang S, Cai S, Wang X (2022) CALPHAD-guided alloy design of Sn–In based solder joints with multiphase structure and their mechanical properties. Mater Sci Eng A 860:144284. https://doi.org/10.1016/j.msea.2022.14428410.1016/j.msea.2022.144284 ↗
43. Tian S, Li S, Zhou J, Xue F, Cao R, Wang F (2017) Effect of indium addition on interfacial IMC growth and bending properties of eutectic Sn–0.7Cu solder joints. J Mater Sci: Mater Electron 28:16120–16132. https://doi.org/10.1007/s10854-017-7512-310.1007/s10854-017-7512-3 ↗
44. Gao Y, Bian X, Qiu X, Jia Y, Yi J, Wang G (2023) Investigation of microstructure and mechanical properties of SAC105 solders with Sb, In, Ni, and Bi additions. Mater (Basel) 16:4059. https://doi.org/10.3390/ma1611405910.3390/ma16114059 ↗
45. Chen Y, You K, Yu S, Yang T, Dong Z, Zhang J, Jia Y, Wang G, Peng J, Cai S, Luo X, Wang J, Liu C (2022) Optimization of mechanical properties of Sn-3.8Ag-0.7Cu alloys by the additions of Bi, In and Ti. Prog Nat Sci: Mater Int 32:643–654. https://doi.org/10.1016/j.pnsc.2022.10.00410.1016/j.pnsc.2022.10.004 ↗
46. Liu X, Wang C, Ohnuma I, Kainuma R, Ishida K (2011) Development of thermodynamic and kinetic databases in micro-soldering alloy systems and their applications. Prog Nat Sci: Mater Int 21:97–110. https://doi.org/10.1016/s1002-0071(12)60042-210.1016/s1002-0071(12)60042-2 ↗
47. Dalton E, Ren G, Punch J, Collins MN (2018) Accelerated temperature cycling induced strain and failure behaviour for BGA assemblies of third generation high Ag content Pb-free solder alloys. Mater Des 154:184–191. https://doi.org/10.1016/j.matdes.2018.05.03010.1016/j.matdes.2018.05.030 ↗
48. Wang Z, Zhang QK, Chen YX, Song ZL (2019) Influences of Ag and In alloying on Sn-Bi eutectic solder and SnBi/Cu solder joints. J Mater Sci: Mater Electron 30:18524–18538. https://doi.org/10.1007/s10854-019-02206-y10.1007/s10854-019-02206-y ↗
49. Chen X, Ma X, Deng Y, Gao P, Li L (2021) The microstructure, melting properties and wettability of Sn–3.5Ag–0.7Cu–xIn lead-free solder alloys. Philos Mag 102:321–339. https://doi.org/10.1080/14786435.2021.199159710.1080/14786435.2021.1991597 ↗
50. Luktuke A, Singaravelu ASS, Mannodi-Kanakkithodi A, Chawla N (2023) Influence of Indium addition on microstructural and mechanical behavior of Sn solder alloys: experiments and first principles calculations. Acta Mater 249:118853. https://doi.org/10.1016/j.actamat.2023.11885310.1016/j.actamat.2023.118853 ↗
51. El-Bediwi AB, El-Bahay MM (2004) Influence of silver on structural, electrical, mechanical and soldering properties of tin-indium based alloys. Radiat Eff Defects Solids 159:133–140. https://doi.org/10.1080/1042015041000167028810.1080/10420150410001670288 ↗
52. El-Daly AA, Hammad AE, Al-Ganainy GS, Ragab M (2014) Influence of Zn addition on the microstructure, melt properties and creep behavior of low Ag-content Sn–Ag–Cu lead-free solders. Mater Sci Eng A 608:130–138. https://doi.org/10.1016/j.msea.2014.04.07010.1016/j.msea.2014.04.070 ↗
53. Wang Y, Lin Y, Tu C, Kao C (2009) Effects of minor Fe Co, and Ni additions on the reaction between SnAgCu solder and Cu. J Alloys Compd 478:121–127. https://doi.org/10.1016/j.jallcom.2008.11.05210.1016/j.jallcom.2008.11.052 ↗
54. Gao B, Meng X, Guo E, Liang H, Cao Z, Wang T (2021) Effects of Ni on the nucleation and growth behavior of Cu6Sn5 in Sn–8.5Cu alloy: an in situ observation. J Alloys Compd 862:158603. https://doi.org/10.1016/j.jallcom.2021.15860310.1016/j.jallcom.2021.158603 ↗
55. Li C, Chen S, Cai S, Peng J, Wang X, Wang Y (2023) Microstructure and shear properties evolution of Mn-doped SAC solder joint under isothermal aging. J Iron Steel Res Int 30:1650–1660. https://doi.org/10.1007/s42243-023-01027-y10.1007/s42243-023-01027-y ↗
56. Xue S-M, Zhou S, Wang X, Zeng X-H, Liu Z-Q (2022) Microstructure coarsening of high-temperature Sn-Pb solder joint in IGBT modules of high-speed trains, 2022 23rd International Conference on Electronic Packaging Technology (ICEPT), IEEE pp. 1–410.1109/ICEPT56209.2022.9873123 ↗
57. Emadi F, Vuorinen V, Ross G, Paulasto-Kröckel M (2023) Co, In, and Co–In alloyed Cu6Sn5 interconnects: microstructural and mechanical characteristics. Mater Sci Eng A 881:145398. https://doi.org/10.1016/j.msea.2023.14539810.1016/j.msea.2023.145398 ↗
58. Mu D, Huang H, Mcdonald SD, Nogita K (2012) Creep and mechanical properties of Cu6Sn5 and (Cu, Ni)6Sn5 at elevated temperatures. J Electron Mater 42:304–311. https://doi.org/10.1007/s11664-012-2227-y10.1007/s11664-012-2227-y ↗
59. Song J, Huang B, Liu C, Lai Y, Chiu Y, Huang T (2012) Nanomechanical responses of intermetallic phase at the solder joint interface–crystal orientation and metallurgical effects. Mater Sci Eng A 534:53–59. https://doi.org/10.1016/j.msea.2011.11.03710.1016/j.msea.2011.11.037 ↗
60. Jennming S, Bochang H, David T, Chihpin H, Kiyokazu Y (2020) Relationship between nanomechanical responses of interfacial intermetallic compound layers and impact reliability of solder joints. Nanomaterials 10:1456. https://doi.org/10.3390/nano1008145610.3390/nano10081456 ↗
61. Mu D, Huang H, Mcdonald SD, Read J, Nogita K (2013) Investigating the mechanical properties, creep and crack pattern of Cu6Sn5 and (Cu, Ni)6Sn5 on diverse crystal planes. Mater Sci Eng A 566:126–133. https://doi.org/10.1016/j.msea.2012.12.05710.1016/j.msea.2012.12.057 ↗
62. Mu D, Yasuda H, Huang H, Nogita K (2012) Growth orientations and mechanical properties of Cu6Sn5 and (Cu, Ni)6Sn5 on poly-crystalline Cu. J Alloys Compd 536:38–46. https://doi.org/10.1016/j.jallcom.2012.04.11010.1016/j.jallcom.2012.04.110 ↗
63. Yu C, Chen W, Duh J (2014) Improving the impact toughness of Sn–Ag–Cu/Cu–Zn Pb-free solder joints under high speed shear testing. J Alloys Compd 586:633–638. https://doi.org/10.1016/j.jallcom.2013.10.11310.1016/j.jallcom.2013.10.113 ↗
64. Emadi F, Vuorinen V, Mertin S, Widell K, Paulasto-Kröckel M (2022) Microstructural and mechanical characterization of Cu/Sn SLID bonding utilizing Co as contact metallization layer. J Alloys Compd 929:167228. https://doi.org/10.1016/j.jallcom.2022.16722810.1016/j.jallcom.2022.167228 ↗
65. Chang F, Lin Y, Hung H, Kao C, Kao CR (2023) Artifact-free microstructures in the interfacial reaction between eutectic In-48Sn and Cu using ion milling. Materials 16:3290. https://doi.org/10.3390/ma1609329010.3390/ma16093290 ↗
66. Verma P, Truhlar DG (2020) Status and challenges of density functional theory. Trends Chem 2:302–318. https://doi.org/10.1016/j.trechm.2020.02.00510.1016/j.trechm.2020.02.005 ↗
67. Zhou Y, Yu W, Khan A, Chong X, Feng J (2020) The investigation on structural, electronic, elastic, adsorptive, catalytic and magnetic properties of precious metal materials via first-principles calculations based on density functional theory — a review. J Micromech Mol Phys 05:2030001. https://doi.org/10.1142/s242491302030001710.1142/s2424913020300017 ↗
68. Yu C, Duh J (2011) Stabilization of hexagonal Cu6(Sn, Zn)5 by minor Zn doping of Sn-based solder joints. Scripta Mater 65:783–786. https://doi.org/10.1016/j.scriptamat.2011.07.02910.1016/j.scriptamat.2011.07.029 ↗
69. Nogita K, MaA MS, Tanaka E, Zeng G, Mcdonald SD, Matsumura S (2016) In Situ TEM Observations of Cu6Sn5 Polymorphic transformations in reaction layers between Sn-0.7Cu solders and Cu substrates. Jom 68:2871–2878. https://doi.org/10.1007/s11837-016-2020-010.1007/s11837-016-2020-0 ↗
70. Zeng G, Mcdonald SD, Gu Q, Suenaga S, Zhang Y, Chen J, Nogita K (2013) Phase stability and thermal expansion behavior of Cu6Sn5 intermetallics doped with Zn, Au and In. Intermetallics 43:85–98. https://doi.org/10.1016/j.intermet.2013.07.01210.1016/j.intermet.2013.07.012 ↗
71. Nogita K, Gourlay CM, Nishimura T (2009) Cracking and phase stability in reaction layers between Sn-Cu-Ni solders and Cu substrates. Jom 61:45–51. https://doi.org/10.1007/s11837-009-0087-610.1007/s11837-009-0087-6 ↗