journal article·2001-03

Thermodynamic description of CuSnP system in the copper-rich corner

Jyrki Miettinen

Calphad· Volume 25· Issue 1
Publisher page

Abstract

Abstract Thermodynamic optimisation is made to describe the properties of the ternary CuSnP system in the copper-rich corner. The thermodynamic parameters of the sub-system CuSn are taken from a recent assessment and the parameters of the sub-systems CuP and SnP, and the ternary CuSnP system are optimised in this study by using experimental data of component activity and phase equilibria. The present ternary description is valid for tin contents up to x sn =0.20 (≈32wt%Sn) and phosphorus contents up to x p =0.25 (≈14wt%P).
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Research context

OpenAlex topics: Electronic Packaging and Soldering Technologies · Metallurgical Processes and Thermodynamics · Metallurgical and Alloy Processes

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