Diffusivities and atomic mobilities for fcc Cu–Ni–Sn alloys
Source abstract
Abstract
Abstract Utilizing five groups of bulk diffusion couples together with electron probe microanalysis technique, the composition-dependent ternary interdiffusion coefficients in fcc Cu–Ni–Sn alloys at 1023 K were determined via the Whittle and Green method. The presently obtained interdiffusion coefficients at 1023 K as well as our previously measured ones at 1073 K were combined with the slightly modified thermodynamic descriptions of the fcc Cu–Ni–Sn phase to explore atomic mobilities of Cu, Ni and Sn in fcc Cu–Ni–Sn alloys within the CALPHAD framework. In order to be consistent with the thermodynamic description, atomic mobilities in binary fcc Ni–Sn alloys were re-evaluated in the present work. The quality of the assessed kinetic characteristics was confirmed by the comprehensive comparisons between various model-predicted diffusion behaviors and the experimental ones, including concentration profiles and diffusion paths.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: High Temperature Alloys and Creep · Electronic Packaging and Soldering Technologies · Aluminum Alloy Microstructure Properties
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
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