journal article·2025-06

Phase transformation temperatures of Sn-Ag-Bi-Cu quaternary system

Sinn-wen Chen, Yi-An Lee, Cheng-Hsi Ho, Jun Zhu, Hsin-Chieh Huang, Te-Wei Lin, Chuan Zhang

Calphad· Volume 89
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Abstract

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OpenAlex topics: Electronic Packaging and Soldering Technologies · Metallurgical and Alloy Processes · Intermetallics and Advanced Alloy Properties

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References (39)

Show source-provided references
1. Klein Wassink · 1989
2. 2012
3. Richards · 1999
4. Sn-In-Ag phase equilibria and Sn-In-(Ag)/Ag Interfacial reactions10.1016/j.matchemphys.2011.02.078 ↗
5. Thermodynamics and phase diagrams of lead-free solder materials
6. Phase diagrams of Pb-free solders and their related materials systems
7. Phase equilibria and solidification of ternary Sn-Bi-Ag alloys10.1016/j.jallcom.2010.03.067 ↗
8. Thermal analysis of the Sn-Ag-Cu-in solder alloy10.1007/s11664-009-1070-2 ↗
9. Thermodynamic description of the quaternary Ag-Bi-Cu-Sn system10.1007/s11664-017-5735-y ↗
10. 2017
11. Accurately determining eutectic compositions: the Sn-Ag-Cu ternary eutectic10.1007/s11837-004-0068-8 ↗
12. Tin-silver-copper eutectic temperature and composition10.1007/s11661-000-0111-5 ↗
13. Experimental determination and thermodynamic calculation of the phase equilibria and surface tension in the Sn-Ag-In system10.1007/s11664-002-0003-0 ↗
14. Experimental study of the Ag–Sn–In phase diagram10.1016/j.jallcom.2005.03.011 ↗
15. F Susan · 2008
16. Liquidus projection and solidification of the Sn-In-Cu ternary alloys10.1007/s11664-008-0380-0 ↗
17. Experimental equilibrium phase diagram of the Ag–Bi–Sn system10.1016/S0925-8388(97)00617-8 ↗
18. Study of microstructure and thermal properties of the low melting Bi-In-Sn eutectic alloys10.1590/1980-5373-mr-2018-0501 ↗
19. Size and substrate effects upon undercooling of Pb-free solders10.1007/s11664-009-0966-1 ↗
20. Phase equilibria of the Ag-Sn-Cu ternary system10.1557/JMR.2004.0296 ↗
21. Phase diagrams for lead-free solder alloys10.1007/BF02709189 ↗
22. Phase diagram calculation: past, present and future10.1016/S0079-6425(03)00025-2 ↗
23. CompuTherm, (https://computherm.com/).
24. 2013
25. Thermodynamic description of the Cu–Sn system10.1557/JMR.2007.0396 ↗
26. Thermodynamic optimization of the In–Pb–Sn system based on new evaluations of the binary borders In–Pb and In–Sn10.1016/j.tca.2003.10.020 ↗
27. Determination of the melting and solidification characteristics of solders by using DSC10.1007/s11661-998-0022-4 ↗
28. Boettinger · 2006 · 960
29. The Ag-Sn (Silver-Tin) system10.1007/BF02869270 ↗
30. Thermal analysis of selected Sn–Ag–Cu alloys10.1007/s10973-012-2583-0 ↗
31. The experimental study of the Bi–Sn, Bi–Zn and Bi–Sn–Zn systems10.1016/j.calphad.2007.04.004 ↗
32. Bi-Sn (Bismuth-Tin)10.1007/s11669-010-9659-y ↗
33. In-Sn (Indium-Tin)10.1361/154770306X110032 ↗
34. A DSC analysis of thermodynamic properties and solidification characteristics for binary Cu–Sn alloys10.1016/j.actamat.2012.08.013 ↗
35. The Cu-Sn (copper-tin) system10.1007/BF03029299 ↗
36. Thermodynamic analysis of the Sn-Ag-Bi ternary phase diagram10.2320/matertrans.42.722 ↗
37. Low temperature soldering using Sn-Bi alloys
38. Thermodynamic analysis and characterization of Bi–Cu–Sn alloys as advanced lead-free solder materials for high temperature application10.1007/s10854-010-0272-y ↗
39. Thermodynamic study of the phase equilibria in the Sn-Ag-Bi-Cu quaternary system10.2320/matertrans.45.380 ↗