Assessment of diffusion mobilities in FCC Cu–Ni alloys
Source abstract
Abstract
Abstract On the basis of the available thermodynamic parameters and experimental data of tracer diffusivity, intrinsic diffusivity and chemical diffusivity in the Cu–Ni binary system, the atomic mobilities of Cu and Ni in face-centered cubic (fcc) Cu–Ni alloys have been assessed as a function of temperature and composition using the CALPHAD approach and DICTRA software package. Comparisons between the calculated and measured diffusion coefficients show that most of the experimental information can be reproduced satisfactorily in the present work. The obtained mobility parameters can also predict reasonably the concentration profiles of the diffusion zone in binary Cu–Ni diffusion couple.
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Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · High Temperature Alloys and Creep · Intermetallics and Advanced Alloy Properties
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References (33)
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