journal article·2024-02

Highly thermoconductive and mechanically robust boron nitride/aramid composite dielectric films from non-covalent interfacial engineering

Junwen Ren, Guoqing Jiang, Zi Wang, Qiuwanyu Qing, Fuli Teng, Zirui Jia, Guanglei Wu, Shenli Jia

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OpenAlex topics: Thermal properties of materials · Dielectric materials and actuators · Graphene research and applications

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References (54)

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