Dielectric properties study of surface engineered nano $$\hbox {TiO}2$$ TiO 2 /epoxy composites
Source abstract
Abstract
Nanodielectrics are promising materials that can efficiently store a large amount of electrical energy that are desirable for many electronic and power devices. Control of polymer–particle interface in nanodielectrics is very critical in not only obtaining the improved quality of dispersion but also in altering the dielectric properties. Various surface modifying agents with linear (alkyl), aromatic (phenyl) and extended aromatic (naphthyl) chemical nature were employed at the epoxy–nano $$\hbox {TiO}2$$ interface. All the surface-modifying agents were successful in passivating the nanoparticles surface and in obtaining the improved quality of polymer–particle dispersion and improved glass transition temperature comparatively. However, all the surface modifiers were not successful in obtaining the improved dielectric properties of the nanodielectrics, especially dielectric breakdown resistance. Only the extended aromatic group at the polymer–particle interface, which is more electron withdrawing in electronic nature than phenyl and alkyl structures, was successful in improving the dielectric breakdown resistance. Thus, the choice of surface-modifying agent based on its chemical and electronic nature is very important in optimizing the dielectric properties of nanodielectrics. Naphthyl phosphate-modified nano $$\hbox {TiO}2$$ –epoxy composite films of $$\sim $$ 90–100 $$\upmu $$ m thick at 5 vol% particle concentration yielded higher dielectric breakdown resistance than pure epoxy polymer and thereby resulted in about 90% higher electrical energy storage density than the pure epoxy film.
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Research context
OpenAlex topics: Dielectric materials and actuators · High voltage insulation and dielectric phenomena · Electromagnetic wave absorption materials
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (27)
Show source-provided references
1. Chu B, Zhou X, Ren K, Neese B, Lin M, Wang Q et al 2006 Science 313 33410.1126/science.1127798 ↗
2. Li J Y, Zhang L and Ducharme S 2007 Appl. Phys. Lett. 90 13290110.1063/1.2716847 ↗
3. Muralidhar C 1988 Jpn. J. Appl. Phys. 27 134910.1143/JJAP.27.1349 ↗
4. Xiaojun Y, Zhimin Y, Changhui M and Jun D 2006 Rare Metals 25 25010.1016/S1001-0521(08)60092-3 ↗
5. Cao Y, Irwin P C and Younsi K 2004 IEEE Trans. Dielectr. Electr. Insul. 11 79710.1109/TDEI.2004.1349785 ↗
6. Ciuprina F, Plesa I, Notingher P V, Tudorache T and Panaitescu D 2008 Annual Report Conference on Electrical Insulation and Dielectric Phenomena, October 26–29, Quebec p 68210.1109/CEIDP.2008.4772905 ↗
7. Kim P, Jones S C, Hotchkiss P J, Haddock J N, Kippelen B and Marder S R 2007 Adv. Mater. 19 100110.1002/adma.200602422 ↗
8. Ramesh S, Shutzberg B A, Huang C, Gao J and Giannelis E P 2003 IEEE Trans. Adv. Packag. 26 1710.1109/TADVP.2003.811365 ↗
9. Bai Y, Cheng Z Y, Bharti V, Xu H S and Zhang Q M 2000 Appl. Phys. Lett. 76 380410.1063/1.126787 ↗
10. Liang S, Chong S R and Giannelis E P 1998 In Proceedings of the 48th Electronic Components and Technology Conference, May 25–28, Seattle, Washington, USA
11. Roy M, Nelson J K, MacCrone R K, Schadler L S, Reed C W, Keefe R et al 2005 IEEE Trans. Dielectr. Electr. Insul. 12 62910.1109/TDEI.2005.1511089 ↗
12. Gilbert L J, Schuman T P and Dogan F 2005 In Ceramic transactions series: advances in electronic and electrochemical ceramics, F Dogan and P M Kumta (eds) (Baltimore: Wiley) 179 p 1710.1002/9781118407899.ch2 ↗
13. Schuman T P, Siddabattuni S, Cox O and Dogan F 2010 Compos. Interface 17 71910.1163/092764410X495315 ↗
14. Hosokawa M, Nogi K, Naito M and Yokoyama T 2007 Nanoparticle technology handbook (Oxford, UK: Elvesier)
15. Siddabattuni S, Schuman T P and Dogan F 2013 ACS Appl. Mater. Interfaces 5 191710.1021/am3030239 ↗
16. Siddabattuni S, Akella S H, Gangula A and Patnaik S 2015 Bull. Mater. Sci. 38 139910.1007/s12034-015-1027-4 ↗
17. Siddabattuni S, Schuman T P and Dogan F 2011 Mater. Sci. Eng. B 176 142210.1016/j.mseb.2011.07.025 ↗
18. Helmy R and Fadeev A Y 2002 Langmuir 18 892410.1021/la0262506 ↗
19. Grest G S and Cohen M H 1981 Adv. Chem. Phys. 48 45510.1002/9780470142684.ch6 ↗
20. Chen H M, Lee L J, Yang J T, Gu X and Jean J C 2009 Mater. Sci. Forum 607 17710.4028/www.scientific.net/MSF.607.177 ↗
21. Blum F D, Sinha B R and Schwab F C 1990 Macromolecules 23 359210.1021/ma00217a600 ↗
22. Blum F D, Lin W Y and Porter C E 2003 Colloid. Polym. Sci. 281 19710.1007/s00396-002-0795-8 ↗
23. Barber P, Balasubramanian S, Anguchamy Y, Gong S, Wibowo A and Gao H 2009 Materials 2 169710.3390/ma2041697 ↗
24. Ma D, Siegel R W, Hong J I and Schadler L S 2004 J. Mater. Res. 19 85710.1557/jmr.2004.19.3.857 ↗
25. Tuncer E, Sauers I, James D R, Ellis A R, Paranthaman M P, Aytug T et al 2007 Nanotechnology 18 2570310.1088/0957-4484/18/2/025703 ↗
26. Macomber R 1996 Organic chemistry Vol 1 (California: University Science Books) p 275
27. Chester T L and Pinkston J D 2005 In Analytical instrumentation handbook, J Cazes (ed), 3rd edn (New York: Marcel Dekker) Chapter 24, p 75910.1201/9780849390395.ch24 ↗