Study of electroless copper plating on ABS resin surface modified by heterocyclic organosilane self-assembled film

6-(3-triethoxysilylpropyl)amino-1, 3, 5-triazine-2, 4-dithiol monosodium (TES) was used to fabricate self-assembled film on corona pretreated acrylonitrile–butadiene–styrene (ABS) resin surface. The self-assembled film modified ABS resin was treated by electroless copper plating. Orthogonal test was carried out to study optimal condition of the process. The surface appearance, plating rate and thickness of electroless copper films were investigated to determine the optimal time of corona-discharge, self-assembly and electroless copper plating. SEM results indicated that porous morphology appeared on ABS resin surface modified by TES self-assembled film and the surface roughness also increased. The adhesion test showed that the adhesion property between ABS resin and copper was excellent. The surface of electroless copper film had high brightness under the optimal condition of 1 min corona-discharge, 30 min self-assembly and 10 min electroless copper plating. The electroless-copper plating temperature was 55 ∼ 60°C and pH was 13 ∼ 13·5.