Enhanced dielectric and thermal performance by fabricating coalesced network of alumina trihydrate/boron nitride in silicone rubber for electrical insulation
Source abstract
Abstract
Silicone rubber filled with micron-alumina trihydrate (ATH) is a substantially used composite material for high voltage outdoor insulators. This article investigates the effect of nano-boron nitride (BN) addition on the dielectric, thermal stability and thermal conductivity of solely micron-ATH-filled silicone rubber by fabricating coalesced network of particles. Micron-ATH/nano-BN-filled hybrid silicone rubber composites are fabricated with a ratio of 30/0 wt% (ATH30), 29/1 wt% (ATBN1), 27/3 wt% (ATBN3), 25/5 wt% (ATBN5) and 23/7 wt% (ATBN7) using mechanical mixing and water bath sonication techniques. Results suggest that the hybrid batch of silicone rubber composites (ATBN) possess lower permittivity, dielectric loss, enhanced thermal stability and thermal conductivity relative to ATH30. ATBN1 offers low permittivity and dielectric loss values of 3.64 and 0.0086 at 1000 Hz relative to 3.87 and 0.0224 of ATH30, respectively. As far as thermal properties are concerned, ATBN5 emerges as the most promising candidate for electrical insulation with 31 and 200°C higher temperatures for 10 and 15% mass loss, whilst it has shown 20% higher thermal conductivity than ATH30.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: High voltage insulation and dielectric phenomena · Dielectric materials and actuators · Thermal properties of materials
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References (15)
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1. Nazir M T, Jiang X and Akram S 2012 Int. J. Electr. Comput. Sci. 12 1
2. Huang X, Chunyi Z, Pingkai J, Dmitri G, Yoshio B and Toshikatsu T 2013 Adv. Funct. Mater. 23 182410.1002/adfm.201201824 ↗
3. Ali M and Hackam R 2008 IEEE Trans. Dielectr. Electr. Insul. 15 136810.1109/TDEI.2008.4656246 ↗
4. Yu S, Li S, Wang S, Huang Y, Nazir M T and Phung B T 2018 IEEE Trans. Dielectr. Electr. Insul. 25 156710.1109/TDEI.2018.007165 ↗
5. Zha J W, Dang Z M, Li W K, Zhu Y H and Chen G 2014 IEEE Trans. Dielectr. Electr. Insul. 21 198910.1109/TDEI.2014.004330 ↗
6. Qi X D, Wang W Y, Xiao Y J, Huang T, Zhang N, Yang J H et al 2019 Compos. Commun. 13 3010.1016/j.coco.2019.02.004 ↗
7. Nazir M T, Phung B T, Zhang Y and Li S 2018 Micro Nano Lett. 14 15010.1049/mnl.2018.5168 ↗
8. Cai X, Dong X, Lv W, Ji C, Jiang Z, Zhang X et al 2020 Compos. Commun. 17 16310.1016/j.coco.2019.12.002 ↗
9. http://www.dcproducts.com.au/RTV_Silicone_Solutions/Tech_Data_Sheets/RTV615-tds.pdf
10. Nazir M T, Phung B T, Yu S, Zhang Y and Li S 2018 High Volt. 3 28910.1049/hve.2018.5033 ↗
11. Nazir M T, Phung B T and Li S 2017 In 2017 IEEE Int’l Sym. on Electr. Insul. Mater. (ISEIM) 1 370
12. Chen X, Song W, Liu J, Chuanmei J and Yi Q 2015 J. Therm. Anal. Calorim. 120 181910.1007/s10973-015-4428-0 ↗
13. Nazir M T, Phung B T, Yu S and Li S 2018 IEEE Trans. Dielectr. Electr. Insul. 25 207610.1109/TDEI.2018.007125 ↗
14. Qi W and Chen G 2014 IEEE Trans. Dielectr. Electr. Insul. 21 180910.1109/TDEI.2013.003585 ↗
15. Zhou W, Wang C, An Q and Ou H 2008 J. Compos. Mater. 42 17310.1177/0021998307086184 ↗