journal article·2012-10

Enhanced thermal conductivity of nano-SiC dispersed water based nanofluid

O MANNA, S K SINGH, G PAUL

Bulletin of Materials Science· Volume 35· Issue 5
Publisher page

Abstract

Silicon carbide (SiC) nanoparticle dispersed water based nanofluids were prepared using up to 0·1 vol% of nanoparticles. Use of suitable stirring routine ensured uniformity and stability of dispersion. Thermal conductivity ratio of nanofluid measured using transient hot wire device shows a significant increase of up to 12% with only 0·1 vol% nanoparticles and inverse dependence of conductivity on particle size. Use of ceramic nanoparticles appears more appropriate to ensure stability of dispersion in nanofluid in closed loop single-phase heat transfer applications.
Source: openaire · Quality: candidate unverified · Source record ↗

Research context

OpenAlex topics: Nanofluid Flow and Heat Transfer · Heat Transfer and Optimization · Phase Change Materials Research

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (21)

Show source-provided references
1. Challoner A R and Powell R W 1956 Proc. R. Soc. London Ser A 238 9010.1098/rspa.1956.0205 ↗
2. Chen G 1996 ASME J. Heat Transf. 118 53910.1115/1.2822665 ↗
3. Chopkar M, Das P K and Manna I 2006 Scr. Mater. 55 54910.1016/j.scriptamat.2006.05.030 ↗
4. Chopkar M, Kumar S, Bhandari D R, Das P K and Manna I 2007 Mater. Sci. Eng. B139 14110.1016/j.mseb.2007.01.048 ↗
5. Das S K, Putra N, Theisen P and Roetzel W 2003 ASME J. Heat Transf. 125 56710.1115/1.1571080 ↗
6. Eastman J A, Choi S U S, Li S, Yu W and Thompson L J 2001 Appl. Phys. Lett. 78 71810.1063/1.1341218 ↗
7. Fecht H J 2002 in Nanostructured materials (ed.) C C Koch (New York: Noyes Publications) p. 73
8. He Y, Jin Y, Chen H, Ding Y, Cang D and Lu H 2007 Int. J. Heat Mass Transf. 50 227210.1016/j.ijheatmasstransfer.2006.10.024 ↗
9. Kim S H, Choi S R and Kim N 2007 J. Heat Transf. 129 29810.1115/1.2427071 ↗
10. Lee S, Choi S U S, Li S and Eastman J A 1999 ASME J. Heat Transf. 121 28010.1115/1.2825978 ↗
11. Manna I, Das P K and Chopkar M 2005 Patent Application filed in India, 390/KOL/2005
12. Patel H E, Das S K, Sundararajan T, Nair A S, George B and Pradeep T 2003 Appl. Phys. Lett. 83 293110.1063/1.1602578 ↗
13. Paul G, Chopkar M, Das P K and Manna I 2010a Renew. Sust. Energ. Rev. 14 191310.1016/j.rser.2010.03.017 ↗
14. Paul G, Pal T and Manna I 2010b J. Colloid Interf. Sci. 349 43410.1016/j.jcis.2010.05.086 ↗
15. Paul G, Philip J, Raj B, Das P K and Manna I 2011 Int. J. Heat Mass Transf. 54 378310.1016/j.ijheatmasstransfer.2011.02.044 ↗
16. Suryanarayana C 2001 Prog. Mater. Sci. 46 110.1016/S0079-6425(99)00010-9 ↗
17. Wang X, Xu X and Choi S U S 1999 J. Thermophys. Heat Transf. 13 47410.2514/2.6486 ↗
18. Wang B X, Zhou P L and Pang X F 2003 Int. J. Heat Mass Transf. 46 363910.1016/S0017-9310(03)00156-X ↗
19. Xie H, Wang J, Xi T and Liu Y 2002 Int. J. Thermophys. 23 57110.1023/A:1015121805842 ↗
20. Xie Z, Ma J, Xu Q and Chang Y 2004 Ceram. Int. 30 21910.1016/S0272-8842(03)00092-0 ↗
21. Xuan Y and Li Q 2000 Int. J. Heat Fluid Flow 21 5810.1016/S0142-727X(99)00067-3 ↗