journal article·2023-07-01

Analytical Modeling of Electronic and Photonic Materials Reliability: Perspective and Extension

E. Suhir

Publisher page

Abstract

Abstract The objective of this review is twofold: to show materials scientists, mechanical engineers, and reliability physicists not involved in electronics, photonics, microelectronic-mechanical-systems (MEMS), or MOEMS (optical MEMS) engineering what kind of value they could bring to this important “high-tech” area, as well as to demonstrate to “high-tech” engineers how they could benefit from the application of what has been developed, for many years, in the general field of physical design for reliability of materials and structures employed in various fields of engineering and applied science and what could be effectively applied to their body of knowledge. Accordingly, in the perspective part of the review, some critical and even paradoxical, i.e., a priori nonobvious, problems encountered in microelectronics and photonics materials science, reliability physics, and structural analysis are addressed using what could be called analytical (“mathematical”) modeling. The extension part has to do with some specific, mostly aerospace, recent applications of the probabilistic design for reliability concept and analytical modeling effort.
Source: crossref · Quality: baseline

Research context

OpenAlex topics: Surface Roughness and Optical Measurements · Near-Field Optical Microscopy · Semiconductor Lasers and Optical Devices

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Portland State University Bell Labs, Murray Hill, NJ (ret), , Portland, OR 97201 ;

ERS Co. , Los Altos, CA 94024

References (100+)

Show source-provided references
1. Shilliday · 1966
2. The Arrhenius-Eyring Inverse Power Law and Combination Models in Accelerated Life Testing10.1016/0143-8174(84)90032-5 ↗
3. Delamination and Debonding of Materials10.1520/STP876-EB ↗
4. Peck · 1987
5. Pagano · 1989
6. Nelson · 199010.1002/9780470316795 ↗
7. Fukuda · 1991
8. Engelmaier · 1991
9. On the Notion of Activation Energy in Reliability: Arrhenius, Eyring and Thermodynamics
10. Interfacial Thermal Stresses in Layered Structures: The Stepped Edge Problem10.1115/1.2792083 ↗
11. Di Giacomo · 1997
12. Generic Requirements GR-468-CORE, “Generic Reliability Assurance Requirements for Optoelectronic Devices Used in Telecommunications Equipment
13. Reliability of Photonic Materials and Structures
14. Pitfalls of Accelerated Testing10.1109/24.722271 ↗
15. Dowling · 1999
16. Condra · 2001
17. Tummala · 2001
18. Suhir · 2008
20. Terms, Definitions, and Letter Symbols for Microcomputers, Microprocessors, and Memory Integrated Circuits
21. Technical Diagnostics in Electronics: Application of Bayes Formula and Boltzmann–Arrhenius–Zhurkov (BAZ) Model
22. Availability Index and Minimized Reliability Cost
23. Failure-Oriented-Accelerated-Testing (FOAT) and Its Role in Making a Viable IC Package Into a Reliable Product10.1007/s10854-017-8224-4 ↗
24. Failure-Oriented-Accelerated-Testing (FOAT) and Its Role in Assuring Electronics Reliability: Review10.29328/journal.ijpra.1001048 ↗
25. Three-Step Concept in Modeling Reliability: Boltzmann-Arrhenius-Zhurkov Physics-of-Failure Based Equation Sandwiched Between Two Statistical Models10.1016/j.microrel.2014.07.001 ↗
26. Suhir · 2021
27. Microelectronics and Photonics—The Future10.1016/S0026-2692(00)00086-0 ↗
28. Love · 1906
29. Timoshenko · 1961
30. Nadai · 1931
31. Liebowitz · 1968
32. Rabotnov · 1987
33. Timoshenko · 1928
34. Timoshenko · 1930
35. Timoshenko · 1961
36. Young · 1975
38. Analysis of Bi-Metal Thermostats10.1364/JOSA.11.000233 ↗
39. Laidler · 1982 · 376
40. Boltzmann · 1982
41. Stresses in Bi-Metal Thermostats10.1115/1.3171827 ↗
42. Timoshenko · 1959
43. Calculated Thermally Induced Stresses in Adhesively Bonded and Soldered Assemblies
44. Die Attachment Design and Its Influence on the Thermally Induced Stresses in the Die and the Attachment
45. On a Paradoxical Situation Related to Bonded Joints: Could Stiffer Mid-Portions of a Compliant Attachment Result in Lower Thermal Stress?10.1299/jmmp.3.990 ↗
46. Analysis of a Short Beam With Application to Solder Joints: Could Larger Stand-off Heights Relieve Stress?10.1051/epjap/2015140492 ↗
47. On a Paradoxical Situation Related to Lap Shear Joints: Could Transverse Grooves in the Adherends Lead to Lower Interfacial Stresses?10.1088/0022-3727/41/11/115505 ↗
48. Novel Shear Test Methodology for the Most Accurate Assessment of Solder Material Properties
49. Interfacial Stresses in a Lap Shear Joint (LSJ): The “Transverse Groove Effect” (TGE) and the Predicted Peeling Stresses10.1299/jmmp.4.1116 ↗
50. Apparatus and Method for Thermostatic Compensation of Temperature Sensitive Devices
51. Research on Glass Ceramics With Negative Coefficient of Thermal Expansion Used as Fiber Bragg Grating Substrate
52. Impact of External Lead Design on the Fracture of HIC-PWB Assemblies Subjected to Bending
53. On a Paradoxical Situation Related to Beams on Elastic Foundations: Could Compliant External Leads Reduce the Strength of a Surface Mounted Device?10.1115/1.3173727 ↗
54. Predicted Curvature of the Glass Fiber From the Measured Curvature of Its Coating10.1109/50.81971 ↗
55. Could the Curvature of an Optical Glass Fiber Be Different From the Curvature of Its Coating?10.1016/0020-7683(93)90127-S ↗
56. Device and Method of Controlling the Bowing of a Soldered or Adhesively Bonded Assembly
57. Predicted Thermal Stresses in a Bow-Free Electronic Assembly for Automotive and Potential Aerospace Applications
58. Analysis of a Pre-Stressed Bi-Material Accelerated Life Test (ALT) Specimen10.1002/zamm.201000101 ↗
59. Analysis of a Bow-Free Pre-Stressed Test Specimen10.1115/1.4028551 ↗
60. Bow-Free Pre-Stressed ALT Specimen
61. A New Approach to the High-Quality Epitaxial Growth of Lattice-Mismatched Materials10.1063/1.97204 ↗
62. Stresses in Bi-Material GaN Assemblies10.1063/1.3638702 ↗
63. Lattice-Misfit Stresses in a Circular Bi-Material Gallium-Nitride Assembly10.1115/1.4007104 ↗
65. Predicted Lattice-Misfit Stresses in a Gallium-Nitride (GaN) Film
66. Predictive Modeling of the Lattice-Misfit Stresses in GaN Film Grown on a Circular Substrate
67. Dynamic Response of a One-Degree-of-Freedom Linear System to a Shock Load During Drop Tests: Effect of Viscous Damping10.1109/95.536846 ↗
68. Design of Shock Table Tests to Mimic Real-Life Drop Conditions10.1109/TCAPT.2009.2020695 ↗
69. Shock-Excited Vibrations of a Conservative Duffing Oscillator With Application to Shock Protection in Portable Electronics10.1016/0020-7683(95)00199-9 ↗
70. Predicted Accelerations of Surface-Mounted Electron Devices During Spacecraft Launch
71. Nonlinear Dynamic Response of a Flexible Thin Plate to Constant Acceleration Applied to Its Support Contour, With Application to Printed Circuit Boards Used in Avionic Packaging10.1016/0020-7683(92)90094-A ↗
72. Is the Maximum Acceleration an Adequate Criterion of the Dynamic Strength of a Structural Element in an Electronic Product?10.1109/95.650942 ↗
73. Nonlinear Dynamic Response of a Flexible Printed Circuit Board to Shock Loads Applied to Its Support Contour
74. Response of a Flexible Printed Circuit Board to Periodic Shock Loads Applied to Its Support Contour10.1115/1.2899498 ↗
75. Dynamic Response of Microelectronics and Photonics Systems to Shocks and Vibrations
76. Nonlinear Dynamic Response of a “Flexible-and-Heavy “Printed Circuit Board (PCB) to an Impact Load Applied to Its Support Contour10.1088/0022-3727/42/4/045506 ↗
77. Could an Impact Load of Finite Duration Acting on a Duffing Oscillator Be Substituted With an Instantaneous Impulse?10.1299/jmmp.4.1381 ↗
78. Suhir · 2011
79. Predictive Modeling of the Dynamic Response of Electronic Systems to Shocks and Vibrations
80. Structural Dynamics of Electronics Systems10.1142/S0217984913300044 ↗
81. Avoiding Inelastic Strains in Solder Joint Interconnections of Space Electronics10.1002/zamm.202200097 ↗
82. Stretchable Electronics: Does One Need a Good Thermal Expansion Match Between the Si Die and the Plastic Carrier?
83. Stretchable” Electronics: Does One Really Need a Good Thermal Expansion (Contraction) Match Between the Silicon Die and the Plastic Carrier?10.1109/ECTC.2009.5074091 ↗
84. Predicted Stresses in Die-Carrier Assemblies in “Stretchable” Electronics: Is There an Incentive for Using a Compliant Bond?10.1002/zamm.201000108 ↗
85. Predicted Response of the Die-Carrier Assembly to the Combined Action of Tension and Bending Applied to the Carrier in Flexible Electronics10.1115/1.4005191 ↗
86. Ultra-Thin Chip Package (UTCP): 60 µm Thick Bendable Chip Package
87. Mechanical Approach to the Evaluation of the Low Temperature Threshold of Added Transmission Losses in Single-Coated Optical Fibers10.1109/50.54502 ↗
88. Assembly Bonded at the Ends: Could Thinner and Longer Legs Result in a Lower Thermal Stress in a Thermoelectric Module Design?10.1115/1.4006597 ↗
89. Predicted Thermal Stresses in a Multi-Leg Thermoelectric Module (TEM) Design10.1115/1.4007524 ↗
90. Suhir · 2013
91. Spring Constant In the Buckling of Dual-Coated Optical Fibers10.1109/50.4121 ↗
92. Effect of Initial Curvature on Low Temperature Microbending in Optical Fibers10.1109/50.4137 ↗
93. Elastic Stability, Free Vibrations, and Bending of Optical Glass Fibers: The Effect of the Nonlinear Stress-Strain Relationship10.1364/AO.31.005080 ↗
94. The Effect of the Nonlinear Behavior of the Material on Two-Point Bending in Optical Glass Fibers10.1115/1.2906425 ↗
95. Suhir · 1995
96. Critical Strain and Post-Buckling Stress in Polymer Coated Optical Fiber Interconnect: What Could Be Gained by Using Thicker Coating?
97. Optical Fiber Interconnect Subjected to a Not-Very-Small Ends Off-Set: Effect of the Reactive Tension10.1557/PROC-531-201 ↗
98. Optical Fiber Interconnect With the Ends Offset and Axial Loading: What Could Be Done to Reduce the Tensile Stress in the Fiber?10.1063/1.1290707 ↗
99. Optical Fiber Interconnects Having Offset Ends With Reduced Tensile Strength and Fabrication Method
100. Fiber Optics Engineering: Physical Design for Reliability10.2298/FUEE1402153S ↗