Interphase layer characteristics and thermal conductivity of hot-forged Cu-B/diamond composites
Source abstract
Abstract
Copper/diamond composites are regarded as the next-generation heat sink materials and have great potential to be used for future high-power electronic devices. The interphase layer characteristics between the copper matrix and the diamond have a significant influence on the composite’s thermophysical properties. In this work, a cost-effective hot forging process is used to fabricate diamond particles (about 70 μm diameter) reinforced Cu-xB matrix (x = 0.3, 0.5 and 1.0 wt.%) composites. The results show that B4C particles are easier to nucleate on the diamond (100) facet than on diamond (111) facet during the hot forging. The morphology of the newly formed B4C interphase layer on the diamond (100) facet evolved from a fine dispersed particle (Cu-0.3B/diamond) to a continuous dense structure (Cu-1B/diamond). On the diamond (111) facet, the B4C nucleation is difficult due to relative stronger carbon bonds formed on the diamond (111) facet (three bonds) than on the diamond (100) facet (two bonds), the growth of previously nucleated B4C become predominated, resulting in forming a B4C interphase layer with large particle size and low density on the diamond (111) facet. The Cu-0.5B/diamond has the highest thermal conductivity among the three fabricated composites (440 W/mK), and a low coefficient of thermal expansion (6.57 × 10–6 /K) at 313 K is obtained. With increasing the diamond particle size to 200 μm, the hot-forged Cu-0.5B/diamond had an increased thermal conductivity (495 W/mK). It demonstrates that hot forging is a feasible method to fabricate Cu/diamond composites with acceptable thermal conductivity from powder mixture.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Advanced ceramic materials synthesis · Aluminum Alloys Composites Properties · Advanced materials and composites
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (41)
Show source-provided references
1. Moore AL, Shi L (2014) Emerging challenges and materials for thermal management of electronics. Mater Today 17:163–17410.1016/j.mattod.2014.04.003 ↗
2. Jia SQ, Yang F (2021) High thermal conductive copper/diamond composites: state of the art. J Mater Sci 56:2241–227410.1007/s10853-020-05443-3 ↗
3. Zhuang J, Sun J, Wu D, Liu Y, Patil RR, Pan D, Guo Z (2021) Multi-factor analysis on thermal conductive property of metal-polymer composite microstructure heat exchanger. Adv Compos Hybrid Mater10.1007/s42114-021-00204-5 ↗
4. Ma JN, Bolzoni L, Yang F (2021) Interface manipulation and its effects on the resultant thermal conductivity of hot-forged copper/Ti-coated diamond composites. J Alloys Compd 868:15918210.1016/j.jallcom.2021.159182 ↗
5. Lei L, Bolzoni L, Yang F (2020) High thermal conductivity and strong interface bonding of a hot-forged Cu/Ti-coated-diamond composite. Carbon 168:553–56310.1016/j.carbon.2020.07.001 ↗
6. Cao H, Tan Z, Lu MH, Ji G, Yan XJ, Di C, Yuan M, Guo Q, Su Y, Addad A, Li Z, Xiong DB (2019) Graphene interlayer for enhanced interface thermal conductance in metal matrix composites: an approach beyond surface metallization and matrix alloying. Carbon 150:60–6810.1016/j.carbon.2019.05.004 ↗
7. Zhao D, Zha S, Liu D (2021) Influence of sputtering and electroless plating of Cr/Cu dual-layer structure on thermal conductivity of diamond/copper composites. Diam Relat Mater 10829610.1016/j.diamond.2021.108296 ↗
8. Xie Z, Guo H, Zhang X, Huang S, Xie H, Mi X (2021) Tailoring the thermal and mechanical properties of diamond/Cu composites by interface regulation of Cr alloying. Diam Relat Mater 114:10830910.1016/j.diamond.2021.108309 ↗
9. Schöbel M, Degischer HP, Vaucher S, Hofmann M, Cloetens P (2010) Reinforcement architectures and thermal fatigue in diamond particle-reinforced aluminum. Acta Mater 58:6421–643010.1016/j.actamat.2010.08.004 ↗
10. Jia SQ, Bolzoni L, Li T, Yang F (2021) Unveiling the interface characteristics and their influence on the heat transfer behavior of hot-forged Cu-Cr/Diamond composites. Carbon 172:390–40110.1016/j.carbon.2020.10.036 ↗
11. Wu Y, Luo J, Wang Y, Wang G, Wang H, Yang Z, Ding G (2019) Critical effect and enhanced thermal conductivity of Cu-diamond composites reinforced with various diamond prepared by composite electroplating. Ceram Int 45:13225–1323410.1016/j.ceramint.2019.04.008 ↗
12. Schubert T, Zieliński W, Michalski A et al (2008) Interfacial characterization of Cu/diamond composites prepared by powder metallurgy for heat sink applications. Scr Mater 58:263–26610.1016/j.scriptamat.2007.10.011 ↗
13. Ren S, Shen X, Guo C, Liu N, Zang J, He X, Qu X (2011) Effect of coating on the microstructure and thermal conductivities of diamond–Cu composites prepared by powder metallurgy. Compos Sci Technol 71:1550–155510.1016/j.compscitech.2011.06.012 ↗
14. Chung CY, Lee MT, Tsai MY, Chu CH, Lin SJ (2014) High thermal conductive diamond/Cu–Ti composites fabricated by pressureless sintering technique. Appl Therm Eng 69:208–21310.1016/j.applthermaleng.2013.11.065 ↗
15. Li J, Wang X, Qiao Y et al (2015) High thermal conductivity through interfacial layer optimization in diamond particles dispersed Zr-alloyed Cu matrix composites. Scr Mater 109:72–7510.1016/j.scriptamat.2015.07.022 ↗
16. Ciupiński Ł, Kruszewski MJ, Grzonka J et al (2017) Design of interfacial Cr3C2 carbide layer via optimization of sintering parameters used to fabricate copper/diamond composites for thermal management applications. Mater Des 120:170–18510.1016/j.matdes.2017.02.005 ↗
17. Bai G, Wang L, Zhang Y, Wang X, Wang J, Kim MJ, Zhang H (2019) Tailoring interface structure and enhancing thermal conductivity of Cu/diamond composites by alloying boron to the Cu matrix. Mater Charact 152:265–27510.1016/j.matchar.2019.04.015 ↗
18. Wang L, Li J, Che Z, Wang X, Zhang H, Wang J, Kim MJ (2018) Combining Cr pre-coating and Cr alloying to improve the thermal conductivity of diamond particles reinforced Cu matrix composites. J Alloys Compd 749:1098–110510.1016/j.jallcom.2018.03.241 ↗
19. Liu RX, Luo GQ, Li Y, Zhang J, Shen Q, Zhang LM (2019) Microstructure and thermal properties of diamond/copper composites with Mo2C in-situ nano-coating. Surf Coat Technol 360:376–38110.1016/j.surfcoat.2018.12.116 ↗
20. Wang L, Li J, Catalano M, Bai G, Li N, Dai J, Wang X, Zhang H, Wang J, Kim MJ (2018) Enhanced thermal conductivity in Cu/diamond composites by tailoring the thickness of interfacial TiC layer. Compos Part A-Appl Sci Manuf 113:76–8210.1016/j.compositesa.2018.07.023 ↗
21. Chang G, Sun FY, Duan JL, Che ZF, Wang XT, Wang JG, Kim MJ, Zhang HL (2018) Effect of Ti interlayer on interfacial thermal conductance between Cu and diamond. Acta Mater 160:235–24610.1016/j.actamat.2018.09.004 ↗
22. Chang G, Sun F, Wang L et al (2019) Regulated interfacial thermal conductance between Cu and diamond by a TiC interlayer for thermal management applications. ACS Appl Mater Interfaces 11:26507–2651710.1021/acsami.9b08106 ↗
23. Zhang H, Zhang J, Liu Y et al (2018) Unveiling the interfacial configuration in diamond/Cu composites by using statistical analysis of metallized diamond surface. Scr Mater 152:84−8810.1016/j.scriptamat.2018.04.021 ↗
24. Kleiner S, Khalid FA, Ruch PW et al (2006) Effect of diamond crystallographic orientation on dissolution and carbide formation in contact with liquid aluminium. Scr Mater 55:291–29410.1016/j.scriptamat.2006.05.003 ↗
25. Lei L, Su Y, Bolzoni L, Yang F (2020) Evaluation on the interface characteristics, thermal conductivity, and annealing effect of a hot-forged Cu-Ti/diamond composite. J Mater Sci Technol 49:7–1410.1016/j.jmst.2020.02.023 ↗
26. Wang L, Li J, Bai G, Li N, Wang X, Zhang H, Wang J, Kim MJ (2019) Interfacial structure evolution and thermal conductivity of Cu-Zr/diamond composites prepared by gas pressure infiltration. J Alloys Compd 781:800–80910.1016/j.jallcom.2018.12.053 ↗
27. Li JW, Zhang HL, Wang LH, Che ZF, Zhang Y, Wang JG, Kim MJ, Wang XT (2016) Optimized thermal properties in diamond particles reinforced copper-titanium matrix composites produced by gas pressure infiltration. Compos Part A-Appl Sci Manuf 91:189–19410.1016/j.compositesa.2016.10.005 ↗
28. Dong YH, Zhang RQ, He XB, Ye ZG, Qu XH (2012) Fabrication and infiltration kinetics analysis of Ti-coated diamond/copper composites with near-net-shape by pressureless infiltration. Mater Sci Eng B 177:1524–153010.1016/j.mseb.2012.08.009 ↗
29. Kidalov SV, Shakhov FM (2009) Thermal conductivity of diamond composites. Materials 2:2467–249510.3390/ma2042467 ↗
30. Grzonka J, Kruszewski MJ, Rosiński M, Ciupiński Ł, Michalski A, Kurzydłowski KJ (2015) Interfacial microstructure of copper/diamond composites fabricated via a powder metallurgical route. Mater Charact 99:188–19410.1016/j.matchar.2014.11.032 ↗
31. Zhang Y, Zhang HL, Wu JH, Wang XT (2011) Enhanced thermal conductivity in copper matrix composites reinforced with titanium-coated diamond particles. Scr Mater 65:1097–110010.1016/j.scriptamat.2011.09.028 ↗
32. Yang L, Sun L, Bai WW, Li LC (2019) Thermal conductivity of Cu-Ti/diamond composites via spark plasma sintering. Diam Relat Mater 94:37–4210.1016/j.diamond.2019.02.014 ↗
33. Chen H, Jia C, Li S et al (2012) Selective interfacial bonding and thermal conductivity of diamond/Cu-alloy composites prepared by HPHT technique. Int J Min Met Mat 19:364–37110.1007/s12613-012-0565-7 ↗
34. Ekimov EA, Suetin NV, Popovich AF, Ralchenko VG (2008) Thermal conductivity of diamond composites sintered under high pressures. Diam Relat Mater 17:838–84310.1016/j.diamond.2007.12.051 ↗
35. Yang F, Sun W, Singh A, Bolzoni L (2018) Effect of minor titanium addition on copper/diamond composites prepared by hot forging. JOM 70:2243–224810.1007/s11837-018-2815-2 ↗
36. Yang F, Su Y, Jia SQ, Zhao QY, Bolzoni L, Li T, Qian M (2019) Titanium-doped copper-diamond composites fabricated by hot-forging of powder mixtures or cold-pressed powder preforms. JOM 71:4867–487110.1007/s11837-019-03833-w ↗
37. Harkins WD (1942) Energy relations of the surface of solids I. Surface energy of the diamond. J Chem Phys 10:268–27210.1063/1.1723719 ↗
38. Chakrabarti DJ, Laughlin DE (1982) The B−Cu (Boron−Copper) system. Bull Alloy Phase Diagr 3:45–4810.1007/BF02873410 ↗
39. Khai TV, Na HG, Kwak DS, Kwon YJ, Ham H, Shim KB, Kim HW (2012) Comparison study of structural and optical properties of boron-doped and undoped graphene oxide films. Chem Eng J 211–212:369–37710.1016/j.cej.2012.09.081 ↗
40. Yuan B, Xing W, Hu Y, Mu X, Wang J, Tai Q, Li G, Liu L, Liew KM, Hu Y (2016) Boron/phosphorus doping for retarding the oxidation of reduced graphene oxide. Carbon 101:152–15810.1016/j.carbon.2016.01.080 ↗
41. Ashcheulov P, Taylor A, Živcová ZV, Hubík P, Honolka J, Vondráček M, Remzová M, Kopeček J, Klimša L, Lorinčik J, Davydova M, Remeš Z, Kohout M, Beltran AM, Mortet V (2020) Low temperature synthesis of transparent conductive boron doped diamond films for optoelectronic applications: Role of hydrogen on the electrical properties. Appl Mater Today 19:10063310.1016/j.apmt.2020.100633 ↗