Effects of Ni Nanoparticles on the Growth Rate of Intermetallic Compounds (IMCs) Between Sn-3.0Ag-0.5Cu (SAC305) Solder and Cu-2.0Be Substrate
Source abstract
Abstract
The effect of Ni nanoparticles on the microstructure evolution of a Sn-3.0Ag-0.5Cu (SAC305)-xNi (x = 0, 0.1)/Cu-2.0Be solder joint during reflow and aging was investigated. The results showed that the doped Ni nanoparticles changed the intermetallic compound (IMC) morphology from a scallop-like structure into a planar-like structure. The interfacial IMC layer thickness of the SAC305/Cu-2.0Be solder joint was greater than that of the SAC305-0.1Ni/Cu-2.0Be solder joint after reflow and aging. During reflow, the average IMC growth rate of the SAC305/Cu-2.0Be solder joint was 1.62 × 10−2 μm/s, while the average IMC growth rate of the SAC305-0.1Ni/Cu-2.0Be solder joint was 1.56 × 10−2 μm/s. During aging, the growth rates of the interfacial IMC layer of the SAC305/Cu-2.0Be solder joint and SAC305-0.1Ni/Cu-2.0Be solder joint were 1.86 × 10−5 μm/s and 1.46 × 10−5 μm/s, respectively. The results show that a trace amount of Ni nanoparticles can impede the growth rate of the interfacial IMC layer.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies · Metallurgical and Alloy Processes
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
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