journal article·1993-06

Tensile properties of aluminum/alumina multi-layered thin films

G. T. Mearini, R. W. Hoffman

Journal of Electronic Materials· Volume 22· Issue 6
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Abstract

No abstract is available for this record. The assistant can identify its topic from the title, but cannot infer the study’s results.

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Research context

OpenAlex topics: Metal and Thin Film Mechanics · Semiconductor materials and devices · Copper Interconnects and Reliability

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References (20)

Show source-provided references
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