Numerical Modeling of Multimaterial Thermoelectric Devices Under Static and Cyclic Thermal Loading

Selection of materials for thermoelectric devices is generally based on a figure of merit that is a function of the Seebeck coefficient, electrical conductivity, and thermal conductivity. While this figure of merit is a useful metric for comparing materials, the relative importance of the constituent properties depends on the particular application and conditions. In addition, multiple materials can be used together to improve the performance or extend the operating range, and determining the performance of such multimaterial combinations requires analysis beyond simply averaging the properties of the constituent materials. In this paper, finite-element numerical simulations under static and cyclic thermal loadings are used to investigate how device performance can be improved by judicious location of the different materials within the device. The results show that the performance of a device with two different materials can be better than that of either of the individual materials. The greatest improvement in performance occurs with cyclic heating, where the overall performance is strongly influenced by the behavior under transient conditions during heating and cooling.