Elevated-Temperature Annealing Effects on AlGaN/GaN Heterostructures
Source abstract
Abstract
The effect of high-temperature annealing of undoped AlGaN/GaN heterostructures on different substrates was systematically studied between 1100°C and 1230°C. An AlN spacer layer was found to add stability to structures on sapphire substrates. AlGaN/GaN heterostructures on SiC substrates demonstrated excellent robustness for the temperature range studied, maintaining their mobility, sheet resistance, and sheet concentration values, even after annealing. A silicon nitride, SiNx, capping layer was found to assist in minimizing surface roughness during annealing and maintaining the electrical characteristics of the heterostructures. AlGaN/GaN heterostructures on SiC substrates showed a 20% decrease in mobility for uncapped samples compared with SiNx-capped samples.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: GaN-based semiconductor devices and materials · ZnO doping and properties · Ga2O3 and related materials
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