DataVXJournal of Electronic MaterialsPaper
journal article·2009-12Open access

Foreword

Sung K. Kang, Iver Anderson, Srini Chada, Jeng-Gong Duh, Laura J. Turbini, Albert Wu, C. Robert Kao, Fay Hua, K. N. Subramanian, Darrel Frear, Carol Handwerker, Fu Guo, Nik Chawla, Kejun Zeng

Journal of Electronic Materials· Volume 38· Issue 12
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Abstract

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Research context

OpenAlex topics: Electronic Packaging and Soldering Technologies · Copper Interconnects and Reliability · Nanomaterials and Printing Technologies

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References

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