Interfacial Reaction Between Eutectic Sn-Pb Solder and Electroplated-Ni as well as Electroless-Ni Metallization During Reflow
Source abstract
Abstract
Electroplated-Ni (EP-Ni) has been adopted gradually as an underbump metallization layer due to its comparatively lower resistivity and higher deposition rate. In this study, the metallurgical reaction between eutectic Sn-Pb solder and EP-Ni as well as electroless-Ni (EL-Ni) was investigated at 200C, 210C, 220C, and 240C. It is found that the growth rate of Ni3Sn4 intermetallic compound (IMC) on EP-Ni was slower than that on EL-Ni. The consumption rate is measured to be 0.97 9 10 -3 lm/s and 1.48 9 10 -3 lm/s for EP-Ni and EL-Ni, respectively. The activation energy is determined to be 51 kJ/mol and 48 kJ/mol for EP-Ni and EL-Ni, respectively. The dense structure of EP-Ni may be responsible for the lower IMC formation rate.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies · Metallurgical and Alloy Processes
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
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