Creep and rupture behavior of Cu wire/lead-free solder-alloy joint specimen

Kepeng Wu; Makoto Aoyama; Noboru Wade; Jie Cui; Shinji Yamada; Kazuya Miyahara

doi:10.1007/s11664-003-0106-2

journal article·2003-12

Creep and rupture behavior of Cu wire/lead-free solder-alloy joint specimen

Kepeng Wu, Makoto Aoyama, Noboru Wade, Jie Cui, Shinji Yamada, Kazuya Miyahara

Journal of Electronic Materials· Volume 32· Issue 12

Publisher page

Source abstract

Abstract

Creep and rupture behavior of Cu wire/lead-free solder-alloy joint specimens have been investigated using Sn-3.5% Ag and Sn-0.5% Cu alloys. A Sn-37% Pb solder alloy is also used as a reference material. The present authors have fabricated a creep-rupture testing machine for Cu wire/solder-alloy joint specimens, performed creep and rupture tests at 303 K and 403 K, analyzed the characteristics of the creep and rupture behavior, and compared these to test specimens cut from the same alloy ingots. It is also found that the rupture strength of the joint specimens is related to the rupture strength of the alloys.

Source: openaire · Quality: candidate unverified · Source record ↗

Research context

Metals & alloys

OpenAlex topics: Electronic Packaging and Soldering Technologies · Aluminum Alloys Composites Properties · Advanced Welding Techniques Analysis

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (9)

Show source-provided references

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