Direct-Write Fabrication of Integrated, Multilayer Ceramic Components
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Abstract
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Research context
OpenAlex topics: Electrical and Thermal Properties of Materials · Additive Manufacturing and 3D Printing Technologies
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References (10)
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1. H. Hayashi, T. Ikeda, and S. Nishigaki, ISHM '91 Proceedings, 508, (1991).
2. H. Mandai, K. Wakino, H. Okamura, and J.P. Canner, Ceram. Trans., 15, 391 (1990).
3. T. Minoru, Y. Mochizuki, A. Nakano, and H. Kobuke, ISHM '92 Proceedings, 269 (1992).
4. R.L. Brown and A.A. Shapiro, Proceedings of the International Conference and Exhibition on Multichip Modules, 1993, 287 (1993).
5. Micropen, Inc., Pittsford, NY.
6. C.E. Drumheller, ISHM '82 Proceedings, (1982).
7. A. Dziedzic, J. Nijs, and J. Szlufcik, Hybrid Circuits, 30, 18 (1993).
8. D. Dimos, P. Yang, T. J. Garino, M. V. Raymond, and M. A. Rodriguez, “Direct-Write Fabrication of Integrated, Multilayer Ceramic Components”, in Solid Freeform Fabrication Symposium Proceedings Austin, TX: University of Texas at Austin (1997) p. 33–40.
9. Bruce H. King, Sherry L. Morissette, Hugh Denham, Joseph Cesarano, III, and Duane Dimos, “Influence of Rheology on Deposition Behavior of Ceramic Pastes in Direct Fabrication Systems”, to be published in Solid Freeform Fabrication Symposium Proceedings Austin, TX: University of Texas at Austin (1998).
10. T.J. Garino, P. Yang, and D. Dimos, to be published.