Improvement in shape memory polymer properties by applying different type of carbon-based fillers
Source abstract
Abstract
This study investigates the performance enhancement of SMPCs (Shape memory polymer composites) by incorporating various mixed carbon-based fillers, aiming to achieve optimized thermal conductivity, improved mechanical properties, and superior shape recovery characteristics. Carbon-based fillers with diverse geometries and varying loadings were integrated into the polymer matrix to simultaneously improve heat conduction, shape memory efficiency, and mechanical robustness. Notably, the 3D (Three-dimensional) filler structures formed by combining fillers with different dimensions effectively enhanced thermal conduction pathways, thus significantly improving thermal conductivity. Additionally, the interconnected 3D filler networks efficiently stored deformation energy, contributing to enhanced shape recovery behavior. Compared to composites reinforced with single filler types, mixed filler SMPCs exhibited remarkable performance improvements, such as a 42.38% enhancement in thermal conductivity, a 173.24% increase in tensile strength, and a 69.50% reduction in shape recovery time. These findings confirm the effectiveness of hybrid carbon-based filler systems in optimizing multifunctional performance, highlighting their potential applicability in diverse industrial fields that demand superior mechanical properties, rapid shape recovery, and excellent thermal characteristics.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Polymer composites and self-healing · Conducting polymers and applications · Photopolymerization techniques and applications
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Korea Institute of Industrial Technology (KITECH)
Jeonbuk National University
Korea Institute of Science and Technology (KIST)
Funding
Ministry of SMEs and Startups · National Research Council of Science and Technology · Korea Institute
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