Fabrication and characterization of copper and copper alloys reinforced with graphene
Source abstract
Abstract
The consistent rise in current density within electrical wires leads to progressively more substantial heat losses attributed to the Joule effect. Consequently, mitigating the electrical resistivity of copper wires becomes imperative. To attain this objective, the development of a composite material that incorporates a more conductive reinforcement, like graphene, holds great promise. The conception of a copper/graphene composite using a powder metallurgy-based approach is presented. An optimum graphene quantity of 0.06 vol.% was obtained by calculation in order to limit the phenomenon of overlapping layers. This synthesis technique enables the dispersion of graphene and the meticulous control of the interface through the growth of CuO(Cu) nanoparticles that are tightly bonded to the reinforcement. The increase in the hardness of the various materials with separation of the graphene sheets by ultrasonic treatment (55.3 to 67.6 HV) was obtained. It is an indicator of the correct distribution of the reinforcement. The influence on the electrical properties of dendritic copper (ρe = 2.30 µΩ.cm) remains limited, resulting in a modest reduction in electrical resistance of around 1.4%. Nevertheless, for flake copper (2.71 µΩ.cm) and brass (7.66 µΩ.cm), we achieved a more substantial reduction of 2.7% and 10%, respectively. With the improvement of graphene quality, there exists a greater potential for further enhancing the electrical properties.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Graphene research and applications · Aluminum Alloys Composites Properties · Electromagnetic wave absorption materials
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Univ. Bordeaux, CNRS, Bordeaux INP, ICMCB, Pessac, France
Schneider Electric SAS, Grenoble, France
CNRS, Univ. Bordeaux, Pessac, France
Sorbonne Universite, CNRS, Laboratoire Interfaces et Systemes Electrochimiques, Paris, France
Department of Electrical and Computer Engineering, University of Nebraska-Lincoln, Lincoln, USA
Funding
Schneider Electric SAS
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