Adhesion measurement of thin films to a porous low dielectric constant film using a modified tape test
Source abstract
Abstract
10.1163/156856102760099906
Only a short abstract or summary was supplied by the source.
Source: openalex_inverted_index · Quality: short
Research context
OpenAlex topics: Copper Interconnects and Reliability · Metal and Thin Film Mechanics · Semiconductor materials and devices
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (10)
Show source-provided references
1. Lee W. W. · Mater. Res. Soc. Bull. · 1997 · 22 · 1910.1557/S0883769400034151 ↗
2. Hendricks N. H. · Mater. Res. Soc. Symp. Proc. · 1996 · 443 · 310.1557/PROC-443-3 ↗
3. 10.1163/156856195X0026610.1163/156856195X00266 ↗
4. 10.1163/156856195X0027510.1163/156856195X00275 ↗
5. Mittal, K. L. and Mittal, K. L., eds. 1978.Adhesion Measurement of Thin Film, Thick Films and Bulk Coatings, 5–17. Philadelphia, PA: ASTM. STP 64010.1520/STP640-EB ↗
6. Mittal, K. L. 1995.Adhesion Measurement of Films and Coatings, Edited by: Mittal, K. L. 1–13. Utrecht: VSP.10.1515/9783112318966-002 ↗
7. Goh L. L. N. · 2
8. Du M. · J. Vac. Sci. Technol. A · 1998 · 16 · 15510.1116/1.580964 ↗
9. Good, R. J. 1978.Adhesion Measurement of Thin Film, Thick Films and Bulk Coatings, Edited by: Mittal, K. L. 18–29. Philadelphia, PA: ASTM. STP 64010.1520/STP38621S ↗
10. Baglin, J. E. E. 1991.Fundamentals of Adhesion, Edited by: Lee, L. H. 363–382. New York: Plenum Press.10.1007/978-1-4899-2073-7_13 ↗