Adhesion of polyimides to ceramics: Effects of aminopropyltriethoxysilane and temperature and humidity exposure on adhesion

The effects of both y-aminopropyltriethoxysilane (APS) and elevated temperature and humidity (T&H) exposure on the adhesion of pyromellitic dianhydride-oxydianiline polyimide to SiO2, Al2O3, and MgO were studied using XPS, SEM, and peel test. Adhesion and T&H stability of PMDA-ODA on SiO2 is significantly improved when APS is used at the interface, while no significant improvement is observed for Al2O3 or MgO. XPS analysis of the surfaces showed no retention of APS on Al2O3 or MgO, while SiO2 did retain APS, as is expected. The APS retention is affected by surface treatment of the oxide prior to APS application.