Thin Film Adhesion: Effect of Glow Discharge on Substrate

Glow discharge treatment of soda lime glass and silica substrates prior to depositing copper films in oil-free ultra high vacuum as well as in conventional vacuum has been found to increase film adhesion suggesting that gross contamination removal is not the only effect of importance in this method of improving film adhesion. There is evidence from Auger electron emission spectroscopy for sorption of gas from the discharge into the substrate surface layers. Desorption of gases from the substrate also appears to take place. A difference in electron emission from a variety of insulating surfaces following glow discharge was observed in a scanning electron microscope, the sign of the change depending on the nature of the discharge gas. No sputtered material from system components could be detected on the substrate and there was no detectable micro-roughening nor net surface electric charge.