Study on the effect of manufacture parameters on the mechanical property of copper plate/magnetic column bonded structure using a parameter identification approach

In this paper, a parameter identification approach was proposed to investigate the influence of the manufacture parameters on the mechanical performance of a copper plate/magnetic pillar bonded structure under axial-shear loading. The cohesive parameters of the selected adhesive were tested under tensile and mode I/II fracture loading conditions. The identification approach was then developed through ABAQUS-ISIGHT joint simulation, using the load-displacement data obtained from bonding strength test of copper plate/magnetic pillar bonded structure. The cohesive parameters experimentally determined and numerically identified were then compared to validate the identification approach developed. The key manufacture parameters during the manufacture of bonded structure were then studied including curing temperature, curing duration and bondline thickness. The results showed that higher temperature, longer curing duration and thinner adhesive layer can usually lead to enhanced bonding strength. The proposed parameter identification method combined with numerical simulation and limited experiment can aid an efficient and reliable determination on the cohesive parameters of the adhesive studied, thus reducing the efforts on conducting complicated mechanical tests with various manufacture parameters.