Organic Additives: A Source of Hydrogen in Copper Cathodes
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OpenAlex topics: Molten salt chemistry and electrochemical processes · Advancements in Battery Materials
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References (13)
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1. E.H. Chia, private communication with Ludvigsson.
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9. Ph. Javet and H.E. Hintermann, “Aspect du Comportement de la Thiouree en Solution Cuivrique,” Electrochimic Acta., Vol. 14, 1969, pp. 527–552.10.1016/0013-4686(69)87038-6 ↗
10. C.C. Roth and H. Leidheisen, Jr., “The Interaction of Organic Compounds with the Surface during the Electrodeposition of Nickel,” J. Electrochem. Soc., Vol. 100, 1953, pp. 553–560.10.1149/1.2780896 ↗
11. B.K. John, J. Hoekstra, B.C. Sison, Jr., and D. Trivich, “Role of Thiourea in the Electrodeposition of Copper,” J. Electrochem. Soc., Vol. 106, 1959, pp. 382–388.10.1149/1.2427364 ↗
12. J. Liopis, J.M. Gamboa, L. Arizmendi and F. Alonso, “Tarnishing Reaction of Copper with Solutions of Thiourea and Derivations, Study by Radiotracers,” J. Electrochem. Soc., Vol. 109, 1962, pp. 368–377.10.1149/1.2425427 ↗
13. G. Lahousse and L. Herrman, “Effect of Thio Compounds on the Electrodeposition of Copper,” Bull. Soc. Chim., Beleges, Vol. 80, 1971, pp. 125–132.10.1002/bscb.19710800114 ↗