Recent progress in Pb-free solders and soldering technologies

journal article·2001-06

Sung K. Kang

JOM· Volume 53· Issue 6

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Abstract

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OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies · Copper Interconnects and Reliability

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

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1. B.R. Allenby et al., Proc. Surface Mount Int., 1 (1992), p. 1.

2. S.K. Kang and A. Sarkhel, J. Electron. Mater., 23 (1994), p. 701.10.1007/BF02651362 ↗

3. P.T. Vianco and C. May, Proc. Surface Mount Int. Conf. (SMTA, Edina, MN, 1995), p. 481.

4. I.E. Anderson, Proc. NEPCON West ’96 Conf., 2 (1996), p. 882.

5. Lead-Free Solder Project Final Report (Ann Arbor, MI: NCMS, August 1997).

6. R. Ninomiya et al., Proc. Inter PACK ’97, vol. 2, (ASME, New York, NY, 1997), p. 1329.

7. S.L. Choi et al., Design and Reliability of Solders and Interconnections, ed. R.K. Mahidhara et al. (Warrendale, PA: TMS, 1997), p. 241.

8. K. Habu et al., Proc. 1997 7th IEEE Int. Symp. Electronics and the Environment (Piscataway, NJ: IEEE, 1999), pp. 21–24.

9. T.L. Ylikoki et al., IEEE Trans. Comp. Packg. and Manuf. Technol., Part C, 20 (July 1997), p. 194.10.1109/3476.649440 ↗

10. S.K. Kang, Metals and Materials, 5 (6) (1999), pp. 545–549.10.1007/BF03026302 ↗

11. K. Seelig and D. Suraski, Proc. 50th Electron. Comp. and Technol. Conf. (IEEE, Piscataway, NJ, 2000), p. 1405.

12. K.G. Snowdon et al., Proc. 50th Electron. Comp. and Technol. Conf. (IEEE, Piscataway, NJ, 2000), p. 1416.

13. A. Mawer et al. (Paper presented at the Packaging Assembly Symposium, Binghamton, NY, 15–17 November 2000).

14. J. Bartelo et al., Proc. APEX2001 (IPC, Northbrook, IL in print).