journal article·2025-04

The Scanning Secondary Moiré Method with Atomic-Level Resolution and Large Micrometer-Scale Field of View

Yao Zhao, Yueyue Xu, Zhanwei Liu, Jiangfan Zhou, Han Liu, Jianxin Nie, Jinzhao Zhao

Acta Mechanica Solida Sinica· Volume 38· Issue 2
Publisher page

Abstract

No abstract is available for this record. The assistant can identify its topic from the title, but cannot infer the study’s results.

Source: Not provided · Quality: missing

Research context

OpenAlex topics: Advanced Electron Microscopy Techniques and Applications · Electron and X-Ray Spectroscopy Techniques · Force Microscopy Techniques and Applications

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (20)

Show source-provided references
1. Peng W. Development status and trend of micro-nano manufacturing technology. Aviat Precis Manuf Technol. 2009;45(2):92.
2. Zhang H, Zhang S. Development of MEMS and nano-technology in aerospace. Aerosp Mater Technol. 2002;32(5):1–4.
3. Yu L, Yu X, Lou X. The design and synthesis of hollow micro-/nanostructures: present and future trends. Adv Mater. 2018;30(38):1800939.10.1002/adma.201800939 ↗
4. Knauss WG, Chasiotis I, Huang Y. Mechanical measurements at the micron and nanometer scales. Mech Mater. 2003;35(3–6):217–31.10.1016/S0167-6636(02)00271-5 ↗
5. Kishimoto S, Egashira M, Shinya N. Microcreep deformation measurements by a moiré method using electron beam lithography and electron beam scan. Opt Eng. 1993;32(3):522–6.10.1117/12.61046 ↗
6. Xie H, Shang H, Dai F, Li B, Xing Y. Phase shifting SEM moiré method. Opt Laser Technol. 2004;36(4):291–7.10.1016/j.optlastec.2003.09.012 ↗
7. Liu Z, Xie H, Fang D, Shang H, Dai F. A novel nano-Moiré method with scanning tunneling microscope (STM). J Mater Process Technol. 2004;148(1):77–82.10.1016/j.jmatprotec.2004.01.042 ↗
8. Su D, Zhu Y. Scanning moiré fringe imaging by scanning transmission electron microscopy. Ultramicroscopy. 2010;110(3):229–33.10.1016/j.ultramic.2009.11.015 ↗
9. Kim S, Lee S, Oshima Y, Kondo Y, Okunishi E, Endo N, Jung J, Byun G, Lee S, Lee K. Scanning moiré fringe imaging for quantitative strain mapping in semiconductor devices. Appl Phys Lett. 2013;102(16): 161604.
10. Ishizuka A, Hytch M, Ishizuka K. STEM moiré analysis for 2D strain measurements. Microscopy. 2017;66(3):217–21.
11. Haas B. Development of quantitative diffraction and imaging based techniques for scanning transmission electron microscopy. Université Grenoble Alpes; 2017.
12. Pofelski A, Woo SY, Le BH, Liu X, Zhao S, Mi Z, Löffler S, Botton GA. 2D strain mapping using scanning transmission electron microscopy Moiré interferometry and geometrical phase analysis. Ultramicroscopy. 2018;187:1–12.10.1016/j.ultramic.2017.12.016 ↗
13. Hÿtch MJ, Snoeck E, Kilaas R. Quantitative measurement of displacement and strain fields from HREM micrographs. Ultramicroscopy. 1998;74(3):131–46.10.1016/S0304-3991(98)00035-7 ↗
14. Wen H, Zhang H, Liu Z, Liu C, Liu S, Yang X, Liu F, Xie H. Stress mapping of a strain superlattice using scanning moiré fringe imaging. Appl Phys Lett. 2018;113(3):31905.10.1063/1.5022842 ↗
15. Naden AB, O’Shea KJ, MacLaren DA. Evaluation of crystallographic strain, rotation and defects in functional oxides by the moiré effect in scanning transmission electron microscopy. Nanotechnology. 2018;29(16): 165704.10.1088/1361-6528/aaae50 ↗
16. Yamanaka J, Shirakura M, Yamamoto C, Sato K, Yamada T, Hara KO, Arimoto K, Nakagawa K, Ishizuka A, Ishizuka K. Feasibility study to evaluate lattice-space changing of a step-graded SiGe/Si (110) using stem Moiré. J Mater Sci Chem Eng. 2018;6(7):8–15.
17. Kondo Y, Endo N, Fukunaga K, Aoyama Y, Asayama K, Lin CC, Kim H. Strain analysis of FinFET device utilizing Moiré fringes in scanning transmission electron microscopy. Microsc Microanal. 2018;24(S1):978–9.10.1017/S143192761800538X ↗
18. Kondo Y, Okunishi E. Magnified pseudo-elemental map of atomic column obtained by Moiré method in scanning transmission electron microscopy. Microscopy. 2014;63(5):391–5.10.1093/jmicro/dfu024 ↗
19. Yang D, Zhang H, Feng J, Sha Z, Wang C, Tian Y. Advances in micro-nano connection technology and failure behavior of electronic packages. Trans China Weld Inst. 2022;43(11):126–36.
20. Yang P. An overview of some key issues about micro/nano manufacturing. Int J Mater Struct Integr. 2008;2(4):363–74.10.1504/IJMSI.2008.022996 ↗