Heat Transfer on an Internal Thermal Insulation Structure for a High-Temperature Device: Numerical Simulation and Experiment

The internal thermal insulation structure serves as a vital subsystem within the thermal insulation system of high-temperature devices, playing a crucial role in effectively maintaining a high-temperature environment, reducing energy consumption, and enhancing testing efficiency. However, during the operation of these devices, the internal thermal insulation structure is inevitably subjected to high temperatures. Therefore, it is essential to focus on the heat transfer performance of this structure. Initially, the internal thermal insulation structure is designed, and the relative dimensions and materials of each component are determined. Subsequently, a finite element model of the internal thermal insulation structure is established, and numerical simulations of heat transfer are conducted under the device’s operating conditions to analyze the thermal insulation structure. This analysis is ultimately validated through high-temperature experiments conducted on specimens of the internal thermal insulation structure. The results indicate that the designed internal thermal insulation structure effectively maintains the high-temperature environment within the device and demonstrates excellent thermal insulation performance, with a maximum heat flux of 66.7 W/m2 and an outer wall surface temperature of 25.98 °C. This work is significant as it lays the groundwork for the design and construction of such devices.