Investigation into Response Characteristics and Fault Diagnosis Methods for Intermittent Faults in High-Density Integrated Circuits Induced by Bonding Wires

Focusing on the challenges posed by the strong randomness, weak manifestation, and difficulty in diagnosing intermittent faults (IFs) in high-density integrated circuits (HDICs)—often induced by bonding wire defects—this paper takes the GPIO interfaces of a typical DSP chip as the research object. It systematically analyzes the response characteristics of intermittent short-circuit and open-circuit faults and proposes a hybrid intelligent diagnosis method based on the Sparrow Search Algorithm-optimized Variational Mode Decomposition and Attention-based Support Vector Machine (SSA–VMD–Attention–SVM). A dedicated fault injection circuit is designed to accurately replicate IFs and acquire the power supply current response signals. The Sparrow Search Algorithm (SSA) is employed to adaptively optimize the parameters of Variational Mode Decomposition (VMD) for effective extraction of frequency-domain features from fault signals. A three-level attention mechanism is introduced to adaptively weight multi-domain features, thereby highlighting the key fault components. Finally, the Support Vector Machine (SVM) is utilized to achieve high-precision fault classification under small-sample conditions. Experimental results demonstrate that the proposed method achieves a diagnostic accuracy of 97.78% for intermittent short-circuit and open-circuit faults in the GPIO interfaces of the DSP chip, significantly outperforming traditional methods and exhibiting notable advantages in terms of diagnostic accuracy, robustness, and interpretability.