The Power Electronic Soldering Process: An Evaluation of Soldering Materials and Basic Soldering Principles
Source abstract
Abstract
The article describes a basic comparison of soldering materials (preforms) from several suppliers, focusing on the main differences in surface structure, internal structure, and contamination on the surface and in the interior of the solder. As a result, we are able to define how different preforms of the surface, preforms related to impurities, or preforms of the structures of the composition parts of the power modules, which are subjected to the soldering process, influence the formation of different void types. Simultaneously an investigation of the impact on the soldering process (heating, cleaning, soldering, cooling), which influences the formation of the solder joint and on the formation intermetallic structure (IMC) and voids, is performed as well. A comparison of the individual results between RTG or X-ray (Radioisotope Thermoelectric Generator) and SAM (Scanning Acoustic Microscopy) are given together with the highlighted differences. This application study was carried out under various settings to investigate the effects of temperature and exposure time on formic acid. The findings confirm that oxide reduction is a time-dependent process. The lowest average void area—0.2%—was observed at the highest tested temperature of 230 °C, and the longest formic acid exposure duration of 300 s.
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Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies · Electromagnetic Compatibility and Noise Suppression
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Semikron-Danfoss Slovakia, 922 03 Vrbove, Slovakia
Department of Mechatronics and Electronics, Faculty of Electrical Engineering and Information Technologies, University of Zilina, 010 26 Zilina, Slovakia
Funding
National grant agency APVV
References (26)
Show source-provided references
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