Numerical Analysis for Cost-Effective Temperature Reduction in High-Power Light-Emitting Diodes Using Thermal via Array
Source abstract
Abstract
The dissipation of excessive heat in high-power light-emitting diodes (LEDs) is essential for maintaining luminous efficiency, color stability, and device lifetime. While the incorporation of thermal vias in substrates is commonly used to improve heat dissipation, increasing their number is difficult in the limited area due to fabrication constraints. In this study, we use finite element analysis to investigate the effects of thermal via configurations on LED performance, including variations in the number of vias, spacing between vias, and their misalignment relative to the LED, arising from manufacturing tolerances. We found that the reduction in LED temperature saturated beyond a certain number of vias. Moreover, heat reduction can be further enhanced by optimizing the spacing between vias under a fixed number of vias. Based on these findings, the design of via configurations can achieve both fabrication feasibility and effective heat dissipation in high-power LEDs.
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Research context
OpenAlex topics: GaN-based semiconductor devices and materials · Semiconductor Quantum Structures and Devices · Thin-Film Transistor Technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Department of Electrical and Information Engineering, Seoul National University of Science and Technology, 232 Gongneung-ro, Nowon-gu, Seoul 01811, Republic of Korea
Department of Bionic Machinery, KIMM Institute of AI Robot, Korea Institute of Machinery and Materials, 156 Gajeongbuk-ro, Yuseong-gu, Daejeon 34103, Republic of Korea
Department of Information Display, Kyung Hee University, Seoul 02447, Republic of Korea
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