Inductance Model of a Backside Integrated Power Inductor in 2.5D/3D Integration
Source abstract
Abstract
Inductor integration is of vital importance for miniaturization of power supply on chips. In this paper, a backside integrated power inductor is presented. The inductor is placed at the backside of a silicon interposer and connected to the front side metal layers by through-silicon vias (TSVs) for area saving and simple fabrication. An inductance model is proposed to effectively capture the total inductance of the power inductor by an analytical method. The results obtained from the analytical model and finite element method exhibit good agreement with various design parameters and the error between the proposed model and measurement remains less than 7.91%, which indicates that the proposed model can predict the inductance suitably.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: 3D IC and TSV technologies · Electronic Packaging and Soldering Technologies · GaN-based semiconductor devices and materials
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Faculty of Electrical Engineering and Computer Science, Ningbo University, Ningbo 315211, China
Funding
National Natural Science Foundation of China
References (26)
Show source-provided references
1. A 30W 90% efficiency dual mode-controlled DC-DC controller with power over ethernet interface for power device10.1109/TVLSI.2017.2662662 ↗
2. Heterogeneous methodology for energy efficient distribution of on chip power supplies10.1109/TPEL.2012.2230408 ↗
3. Design and optimization of inductive coupling links for 3-D ICs10.1109/TVLSI.2018.2881075 ↗
4. Theoretical and experimental studies of flip-chip assembled high Q suspended MEMs inductors10.1109/TMTT.2007.897716 ↗
5. Shepard, J. (2006). Micrel’s MIC2285 merges LDO and buck regulator. New Ind. Prod., Available online: https://eepower.com/new-industry-products/micrels-mic2285-merges-ldo-and-buck-regulators/.
6. An all-digital fully integrated inductive buck regulator with a 250MHz multi-sampled compensator and a lightweight auto-tuner in 130nm CMOS10.1109/JSSC.2017.2693243 ↗
7. High-Q 3D micro fabricated magnetic-core toroidal inductors for power supplies in package10.1109/TPEL.2018.2847439 ↗
8. 3D MEMS in chip solenoid inductor with high inductance density for power MEMS device10.1109/LED.2019.2941003 ↗
9. Integration of a monolithic buck converter power IC and bond wire inductors with ferrite epoxy glob cores10.1109/TPEL.2010.2100829 ↗
10. Design and optimization of resonance based efficient wireless power delivery systems for biomedical implants10.1109/TBCAS.2010.2072782 ↗
11. Optimization and design of small circular coils in a magnetically coupled wireless power transfer system in the megahertz frequency
12. Accurate modeling of coil inductance for near-field wireless power transfer10.1109/TMTT.2018.2854190 ↗
13. Low cost thin glass interposers as a superior alternative to silicon and organic interposers for packaging of 3D ICs10.1109/TCPMT.2012.2204392 ↗
14. Active silicon interposer design for interposer-level wireless power transfer technology for high density 2.5D and 3D ICs
15. Simple and accurate inductance model of 3D inductor based on TSV10.1049/el.2016.2241 ↗
16. Modeling and characterization of TSV capacitor and stable low capacitance implementation for wide I/O application10.1109/TDMR.2015.2397698 ↗
17. Ultra-compact TSV based L-C low-pass filter with stopband up to 40GHz for microwave application10.1109/TMTT.2018.2882809 ↗
18. Redistribution layers (RDLs) for 2.5D/3D IC integration10.4071/imaps.406 ↗
19. A novel silicon-embedded coreless inductor for high-frequency power management applications10.1109/LED.2010.2082489 ↗
20. A new fan-out package embedded power inductor technology10.1109/LED.2019.2962161 ↗
21. Microfabricated air-core toroidal inductor in very high frequency power converter10.1109/JESTPE.2018.2798927 ↗
22. Grover, F.W. (1946). Inductance Calculation: Working Formulas and Tables, Courier Corporation. Special Edition Prepared for Instrument Society America Press.
23. Physical modeling of spiral inductors on silicon10.1109/16.824729 ↗
24. Modeling of mutual inductance between two misalignment planar coils in wireless power transfer10.1109/LMWC.2020.3006211 ↗
25. Inductance modeling of interconnects in 3-D stacked chip packaging10.1109/LMWC.2018.2811248 ↗
26. (2020, September 27). Manual of Ansoft Q3D. Available online: http://www.peraglobal.com/content/details_254_3020.html.