journal article·2022-12-16Open access

Fabrication and Characterization of Gel-Forming Cr2O3 Abrasive Tools for Sapphire Substrate Polishing

Liang Zhao, Kaiping Feng, Binghai Lyu, Tianchen Zhao, Zhaozhong Zhou

Applied Sciences· Volume 12· Issue 24

Abstract

This paper proposes a gel-formed abrasive tool to address the problem of abrasive agglomeration in a traditional hot-pressing abrasive tool. The effect of Polyimide resin content on the mechanical properties of the gel abrasive tools were tested, and a comparison of the mechanical properties of the gel abrasive tool and the hot-pressing tool was conducted. An orthogonal experiment was conducted to explore the best combination of machining parameters. A polishing experiment of sapphire was conducted to compare the processing effect of the gel abrasive tool and hot-pressing tool. The results from testing the mechanical properties showed that the tensile, flexural, and impact strength of the gel abrasive tool was better than that of the hot-pressing abrasive tool. The results of the orthogonal experiment showed that the best process parameters of the gel abrasive tool were a spindle speed of 900 rpm, a feed rate of 8 μm/min, and a grinding depth of 16 μm. The polishing experiment showed that the gel abrasive tool had a better processing effect on sapphire. The sapphire surface processed by the gel abrasive tool had no deep scratches, and an ultrasmooth surface could be obtained after chemical mechanical polishing (CMP).
Source: crossref · Quality: baseline

Research context

OpenAlex topics: Advanced Surface Polishing Techniques · Advanced machining processes and optimization · Tunneling and Rock Mechanics

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

College of Mechanical Engineering, Quzhou University, Quzhou 324000, China

Ultra-Precision Machining Centre, Zhejiang University of Technology, Hangzhou 310014, China

Key Laboratory of Air-Driven Equipment Technology of Zhejiang Province, Quzhou University, Quzhou 324000, China

Funding

Natural Science Foundation of Zhejiang Province · Quzhou Science and Technology Project

References (31)

Show source-provided references
1. A lapping-based test method to investigate wear behaviour of bonded-abrasive tools10.1016/j.cirp.2022.04.049 ↗
2. Tool wear behavior of alumina abrasive wheels during grinding FGH96 powder metallurgy nickel-based superalloy10.1016/j.procir.2020.04.161 ↗
3. The effect of pressure gradient and abrasive tool wear when polishing ceramic tiles10.1016/j.matpr.2020.07.610 ↗
4. Surface finishing of aluminium 6061 using fabricated flexible abrasive tool10.1016/j.mtcomm.2022.104614 ↗
5. CMP behavior of alumina/metatitanic acid core–shell abrasives on sapphire substrates10.1016/j.precisioneng.2017.05.013 ↗
6. An approach for hydrophobic fixed abrasive pad based on layer-by-layer method10.1016/j.mee.2021.111505 ↗
7. Friction and wear characteristics of agglomerated diamond abrasives and lapping performance of fixed agglomerated diamond pads10.1016/j.wear.2020.203598 ↗
8. Stability of Colloidal Silica Polishing Solution and Its Effect on SiC Chemical Mechanical Polishing
9. Liu, C.-L., Tseng, C.-J., Hsaio, W.-H., Wu, S.-H., and Lu, S.-R. (2022). Predicting the Wafer Material Removal Rate for Semiconductor Chemical Mechanical Polishing Using a Fusion Network. Appl. Sci., 12.10.3390/app122211478 ↗
10. Effect of Different Abrasives on sapphire Chemical-mechanical Polishing
11. Effect of particle size distribution of silica abrasives on chemical mechanical polishing of sapphire
12. Preparation of a novel catalyst (SoFeIII) and its catalytic performance towards the removal rate of sapphire substrate during CMP process10.1016/j.triboint.2017.12.016 ↗
13. Influence of sodium chloride crystais on polishing performance of resin bond polishing pad
14. Tribological effects of loose alumina abrasive assisted sapphire lapping by a fixed agglomerated diamond abrasive pad(FADAP)10.1016/j.mssp.2022.106556 ↗
15. Machining experiment of single crystal sapphire based on pre-gelatinized polysaccharide bonded abrasive tool
16. Effect of Mn-Based Slurries on Chemical Mechanical Polishing of SiC Substrates10.1149/2162-8777/ac7bef ↗
17. Chemical mechanical polishing for sapphire wafers using a developed slurry10.1016/j.jmapro.2021.01.004 ↗
18. Preparation and Performance Analysis of Gel-forming Diamond Abrasive Polishing Disc for Polishing SiC Wafer
19. Ultra-precision grinding of 4H-SiC wafer by PVA/PF compsite sol-gel diamond wheel10.1177/16878140211044929 ↗
20. Study on Precision Grinding of SiC Ceramic by PAV/PF Composite Sol-gel Grinding Abrasive Tool
21. Fabrication and Application of Gel Forming Ultrafine Diamond Abrasive Tools10.1149/2162-8777/ac0a99 ↗
22. Green fabrication of graphene oxide/epoxy nanocomposite and its application in diamond abrasive tools10.1016/j.compositesb.2019.107383 ↗
23. The effects of SiO 2 coating on diamond abrasives in sol-gel tool for SiC substrate polishing10.1016/j.diamond.2017.05.003 ↗
24. Advances in fabrication of ceramic corundum abrasives based on sol–gel process10.1016/j.cja.2020.07.004 ↗
25. Gu, X.R., and Zhu, Y.P. (2005). Gel Chemistry, Chemical Industry Press. Available online: https://www.cip.com.cn/Book/Index/1828.
26. Study on the potential of chemo-mechanical-grinding (CMG) process of sapphire wafer10.1007/s00170-016-9836-1 ↗
27. Chemo-mechanical grinding by applying grain boundary cohesion fixed abrasive for monocrystal sapphire10.1016/j.precisioneng.2021.01.015 ↗
28. Study on the finishing capability and abrasives-sapphire interaction in dry chemo-mechanical-grinding (CMG) process10.1016/j.precisioneng.2018.02.007 ↗
29. Research on the Optimization of Predictive Model for Surface Roughness of Magnesium Alloy
30. Mirror Grinding Process for Aluminum Alloy Using Elastic Grinding Wheel
31. Chen, F. (2009). Research on Wear Mechanism and Dressing Technology of Semi-Fixed Abrasive Plate. [Master’s Thesis, Zhejiang University of Technology].