journal article·2020-09-12Open access

Reconstruction of Pressureless Sintered Micron Silver Joints and Simulation Analysis of Elasticity Degradation in Deep Space Environment

Wendi Guo, Guicui Fu, Bo Wan, Ming Zhu

Applied Sciences· Volume 10· Issue 18

Abstract

With excellent economy and properties, pressureless sintered micron silver has been regarded as an environmentally friendly interconnection material. In order to promote its reliable application in deep space exploration considering the porous microstructural evolution and its effect on macroscopic performance, simulation analysis based on the reconstruction of pressureless sintered micron silver joints was carried out. In this paper, the deep space environment was achieved by a test of 250 extreme thermal shocks of −170 °C~125 °C, and the microstructural evolution was observed by using SEM. Taking advantage of the morphology autocorrelation function, three-dimensional models of the random-distribution medium consistent with SEM images were reconstructed, and utilized in further Finite Element Analysis (FEA) of material effective elastic modulus through a transfer procedure. Compared with test results and two analytical models, the good consistency of the prediction results proves that the proposed method is reliable. Through analyzing the change in autocorrelation functions, the microstructural evolution with increasing shocks was quantitively characterized. Mechanical response characteristics in FEA were discussed. Moreover, the elasticity degradation was noticed and the mechanism in this special environment was clarified.
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Research context

OpenAlex topics: Advanced materials and composites · Advanced machining processes and optimization · Injection Molding Process and Properties

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

School of Reliability and Systems Engineering, Beihang University, Beijing 100191, China

China Academy of Space Technology, Beijing 100094, China

Funding

Equipment Pre-research Fund Project in China

References (32)

Show source-provided references
1. GarciaBlanco, S., and Ramesham, R. (2011, January 17–21). Reliability of tin-lead and lead-free solders of surface mounted miniaturized passive components for extreme temperature space missions. Proceedings of the 41st International Conference on Environmental Systems 2011 (ICES 2011), Portland, Oregon.
2. Li, Y., Fu, G., Wan, B., Jiang, M., Zhang, W., and Yan, X. (2020). Failure analysis of sac305 ball grid array solder joint at extremely cryogenic temperature. Appl. Sci., 10.10.3390/app10061951 ↗
3. X-Ray Microtomography of Thermal Cycling Damage in Sintered Nano-Silver Solder Joints10.1002/adem.201801029 ↗
4. Zhang, H., Chen, C., Jiu, J., Nagao, S., and Suganuma, K. (2018). High-temperature reliability of low-temperature and pressureless micron Ag sintered joints for die attachment in high-power device. J. Mater. Sci. Mater. Electron.10.1007/s10854-018-8903-9 ↗
5. Knoerr, M., Kraft, S., and Schletz, A. (2010, January 8–10). Reliability assessment of sintered nano-silver die attachment for power semiconductors. Proceedings of the 2010 12th Electronics Packaging Technology Conference (EPTC 2010), Singapore.10.1109/EPTC.2010.5702605 ↗
6. A Predictive Model for Thermal Conductivity of Nano-Ag Sintered Interconnect for a SiC Die10.1007/s11664-019-06984-3 ↗
7. Microstructural and mechanical evolution of silver sintering die attach for SiC power devices during high temperature applications10.1016/j.jallcom.2018.10.067 ↗
8. Sun, Z., Wang, Z., Qian, C., Ren, Y., Feng, Q., Yang, D., and Sun, B. (2019, January 24–27). Characterization of stochastically distributed voids in sintered nano-silver joints. Proceedings of the 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, (EuroSimE 2019), Hannover, Germany.10.1109/EuroSimE.2019.8724592 ↗
9. Reliability Evaluation of Multichip Phase-Leg IGBT Modules Using Pressureless Sintering of Nanosilver Paste by Power Cycling Tests10.1109/TPEL.2016.2619118 ↗
10. A computational investigation of the effect of three-dimensional void morphology on the thermal resistance of solder thermal interface materials10.1016/j.applthermaleng.2018.07.002 ↗
11. Effects of voids on mechanical and thermal properties of the die attach solder layer used in high-power LED chip-scale packages10.1109/TCPMT.2018.2789345 ↗
12. Zhu, L., Xu, Y., Zhang, J., Liang, L., and Liu, Y. (2015, January 11–14). Reliability study of solder interface with voids using an irreversible cohesive zone model. Proceedings of the 16th International Conference on Electronic Packaging Technology (ICEPT 2015), Changsha, China.10.1109/ICEPT.2015.7236728 ↗
13. Power modules die attach: A comprehensive evolution of the nanosilver sintering physical properties versus its porosity10.1016/j.microrel.2015.06.085 ↗
14. Influence of the Porous Microstructure on the Elastic Properties of Sintered Ag Paste as Replacement Material for Die Attachment10.1007/s11664-015-3791-8 ↗
15. Torquato, S. (2002). Microstructural Descriptors. Random Heterogeneous Materials, Springer.10.1007/978-1-4757-6355-3 ↗
16. Malmir, H., Sahimi, M., and Jiao, Y. (2018). Higher-order correlation functions in disordered media: Computational algorithms and application to two-phase heterogeneous materials. Phys. Rev. E.10.1103/PhysRevE.98.063317 ↗
17. Izadi, H., Baniassadi, M., Hormozzade, F., Dehnavi, F.N., Hasanabadi, A., Memarian, H., and Soltanian-Zadeh, H. (2018). Effect of 2D Image Resolution on 3D Stochastic Reconstruction and Developing Petrophysical Trend. Transp. Porous Media.10.1007/s11242-018-0997-2 ↗
18. Safdari, M., Baniassadi, M., Garmestani, H., and Al-Haik, M.S. (2012). A modified strong-contrast expansion for estimating the effective thermal conductivity of multiphase heterogeneous materials. J. Appl. Phys.10.1063/1.4768467 ↗
19. A superior descriptor of random textures and its predictive capacity10.1073/pnas.0905919106 ↗
20. Application of full set of two point correlation functions from a pair of 2D cut sections for 3D porous media reconstruction10.1016/j.petrol.2016.10.065 ↗
21. Quantitative characterization of spatial clustering in three-dimensional microstructures using two-point correlation functions10.1016/j.actamat.2003.09.016 ↗
22. Wang, Q., Zhang, H., Cai, H., Fan, Q., and Li, G. (2016). Reconstruction of co-continuous ceramic composites three-dimensional microstructure solid model by generation-based optimization method. Comput. Mater. Sci.10.1016/j.commatsci.2016.02.027 ↗
23. New three-dimensional modeling technique for studying porous media
24. 3D reconstruction and design of porous media from thin sections10.1016/j.ijheatmasstransfer.2014.02.006 ↗
25. Effective elastic moduli of porous solids10.1007/BF00582462 ↗
26. Elastic properties of a tungsten-silver composite by reconstruction and computation10.1016/S0022-5096(99)00016-2 ↗
27. Reconstructing Random Media I and II10.1103/PhysRevE.58.224 ↗
28. Dullien, F.A.L. (1979). Porous Media: Fluid Transport and Pore Structure, Academic Press.10.1016/B978-0-12-223650-1.50008-5 ↗
29. Novel silver die-attach technology on silver pre-sintered DBA substrates for high temperature applications10.1016/j.microrel.2018.06.010 ↗
30. In situ transmission electron microscopy and scanning transmission electron microscopy studies of sintering of Ag and Pt nanoparticles10.1016/j.actamat.2014.08.028 ↗
31. Kim, D., Chen, C., Pei, C., Zhang, Z., Nagao, S., Suetake, A., Sugahara, T., and Suganuma, K. (2019). Thermal shock reliability of a GaN die-attach module on DBA substrate with Ti/Ag metallization by using micron/submicron Ag sinter paste. Jpn. J. Appl. Phys., 58.10.7567/1347-4065/ab0278 ↗
32. Wang, X., and Atkinson, A. (2011). Microstructure evolution in thin zirconia films: Experimental observation and modelling. Acta Mater.10.1016/j.actamat.2010.12.056 ↗