Numerical Design and Laboratory Testing of Encapsulated PCM Panels for PCM-Air Heat Exchangers
Source abstract
Abstract
Heat transfer between encapsulated PCM panels and air plays an important role in PCM-Air heat exchangers. A new design for the encapsulation panel was developed considering practical aspects such as the cost of production and ease of manufacturing, in addition to heat transfer and pressure drop. A number of encapsulated panel surfaces were first investigated via 3D CFD simulations and compared with an existing panel in use by a commercial PCM-Air heat exchanger manufacturer. After validation, 2D CFD simulations were carried out for 32 different geometries to select the most effective design, which was fabricated and tested in the laboratory. Laboratory parameters tested included heat transfer, pressure drop and melting/solidifying. The laboratory results confirmed the improvements of the new panel in comparison with the existing panel and a flat panel. It was found that the proposed design doubled the heat transfer, holds 13.7% more material and the fan can overcome the increased pressure drop.
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Research context
OpenAlex topics: Phase Change Materials Research · Heat Transfer and Optimization · Adsorption and Cooling Systems
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Federal Institute of Pernambuco, Rod. PE-60, km14, Ipojuca-PE 55590-000, Brazil
Department of Mechanical and Aerospace Engineering, Brunel University London, Kingston Lane, Uxbridge UB8 3PH, UK
Pontifical Catholic University of Rio de Janeiro (PUC-Rio), Rua Marquês de São Vicente 225, Rio de Janeiro 22451-900, Brazil
Monodraught Ltd., Halifax House, High Wycombe HP12 3SE, UK
Funding
CNPq - Brazil
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