Show source-provided references
2. Noijenh, S.P.M., van der Sluis, O., and Timmermans, P.H.M. (2012, January 16–18). An Extensive Investigation of the Four Point Bending Test for Interface Characterization. Proceedings of the 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE, Cascais, Portugal.
10.1109/ESimE.2012.6191714 ↗5. Acoustic microscopy
7. An angular-spectrum approach to contrast in reflection acoustic microscopy
10.1063/1.324460 ↗11. Blister patterns and energy minimization in compressed thin films on compliant substrates
10.1002/cpa.21540 ↗14. Single-chain polystyrene particles adsorbed on the silicon surface: A molecular dynamics simulation
10.1021/la990361w ↗15. Vibration characteristics for piezoelectric cylinders using amplitude- fluctuation electronic speckle pattern Interferometry
10.2514/2.336 ↗17. Opto-acoustic technique to evaluate adhesion strength of thin-film systems
10.1063/1.4719698 ↗18. Opto-Acoustic Technique to Investigate Interface of Thin-Film Systems
19. OFV-5000 Vibrometer Controller. Available online: http://www.polytec.com/us/products/vibration-sensors/single-point-vibrometers/ modular-systems/ofv-5000-vibrometer-controller/.
20. DD-300 24 MHz Dispolacement Decoder. Available online: http://www.polytec.com/fileadmin/user_uploads/Products/Vibrometers/OFV-Decoder/Displacement_Decoder/Documents/OM_DS_DD-300_2010_07_PDF_E.pdf.
21. Basnet, M., Yoshida, S., Tittmann, B.R., Kalkan, A.K., and Miyasaka, C. (2010, January 4–6). Quantitative Nondestructive Evaluation for Adhesive Strength at an Interface of a Thin Film System with Opto-Acoustic Techniques. Proceedings of the 47th Annual Technical Meeting of Society of Engineering Science, Ames, IA, USA.
23. Miyasaka, C. Personal communication.
24. Ishiyama, C., Tasaki, T., Tso-Fu Mark Chan, T.M., and Sone, M. (2012). Effects of specimen dimensions on adhesive shear strength between a microsized SU-8 column and a silicon substrate. Jpn. J. Appl. Phys., 51.
10.7567/JJAP.51.06FL19 ↗