A Study on the Influence of the Cross-Sectional Shape of the Metal-Inserted Retainer Ring and the Pressure Distribution from the Multi-Zone Carrier Head to Increase the Wafer Yield
Source abstract
Abstract
In this paper, for the purpose of increasing the wafer yield by controlling the non-uniformity of the material removal rate during the chemical mechanical polishing process, the influence of the cross-sectional shape of the metal-inserted retainer ring and the pressure distribution on the wafer and the retainer ring generated from the multi-zone carrier head are investigated. First, in order to verify the finite element analysis model, it is correlated using the test data. By using a validated finite element model, simulation studies involving several parameters are performed to reduce the irregularity in the wafer: (1) tapered bottom of the retainer ring, (2) machining round corners at the bottom of the retainer ring, (3) the changes in pressure applied to the wafer, (4) the changes in pressure applied to the retainer ring.
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Research context
OpenAlex topics: Advanced Surface Polishing Techniques · Advanced machining processes and optimization · Advanced Machining and Optimization Techniques
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Department of Mechanical Engineering, Korea Polytechnic University, 237 Sangidaehak-ro, Siheung-Si, Gyeonggi-do 15073, Korea
Daegu Research Center for Medical Devices and Rehabilitation, Korea Institute of Machinery and Materials, Daegu 42994, Korea
Funding
National Research Foundation of Korea · the GRRC program of Gyeonggi province
References (17)
Show source-provided references
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