Evaluation of Ultrasonic Bonding Strength with Optoacoustic Methods
Source abstract
Abstract
This study reports the application of an optoacoustic method for evaluating the bonding strength of ultrasonically bonded joints in a non-destructive and non-contact fashion. It is proposed that the bonding strength is correlated with the resonant frequency of bonded joints. The bonding strength measured with a destructive tensile test roughly increased with the vibration time, however, it varied, causing the transitional and dispersed formation of micro-bonds at the bonding interface. Scanning Electron Microscopic observation of the fractured surface suggested that the bonding strength depends on the total bonded area of micro-bonds. Frequency response of the bonded joint was examined with a non-destructive method using a piezo-electric vibrator. The experiment revealed that the resonant frequency exponentially increased with the bonding strength. In addition, this vibration behavior was dynamically visualized with electronic speckle pattern interferometry (ESPI). The correlation between the bonded area and the resonant frequency is discussed based on finite element analysis. The results indicate the possibility for in-situ evaluation of the ultrasonic bonding strength.
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Research context
OpenAlex topics: Thermography and Photoacoustic Techniques · Ultrasonics and Acoustic Wave Propagation · Photoacoustic and Ultrasonic Imaging
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Graduate School of Niigata University, 8050 Ikarashi-ninocho, Nishi-ku, Niigata-shi, Niigata 950-2181, Japan
Department of Chemistry and Physics, Southeastern Louisiana University, Hammond, LA 70402, USA
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