In-Situ Observation of Adhesion Behavior During Ultrasonic Al Ribbon Bonding
Source abstract
Abstract
In-situ observation was performed on a transparent silica substrate during ultrasonic Al ribbon bonding, using a high-speed video camera with differing frame rates, 104 fps and 103 fps, to clarify the adhesion behavior. The bonding process was observed as follows. Initially, friction slip occurred, producing multiple island streaks in the direction parallel to the ultrasonic vibration. The island streaks were formed as a scratch, due to surface waviness of the Al ribbon. Momentarily, a belt-shaped bond zone was formed at the center, normally due to the ultrasonic vibration. The island streaks could be clearly observed at 104 fps. However, the central belt zone was unclear and appeared translucent at 104 fps; although it was clear when observed at 103 fps. The island streaks were unclear at 103 fps. The positional relation of the island streaks and the central belt zone was confirmed from in-situ observation results of a twist and peel test of Al ribbon bonded to silica substrate. The central belt zone was between the island streaks and the silica substrate.
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Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies · Adhesion, Friction, and Surface Interactions
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Joining and Welding Research Institute, Osaka University, 11-1, Mihogaoka, Ibaraki, Osaka 567-0047, Japan
Graduate School of Engineering, Osaka University, 2-1, Yamadaoka, Suita, Osaka 567-0047, Japan
References (50)
Show source-provided references
1. Solid-state microjoining mechanisms of wire bonding and flip chip bonding10.1115/1.4038143 ↗
2. Microstructure evolution and mechanical properties of extruded Mg96Zn2Y2 alloy joints with ultrasonic spot welding10.1016/j.msea.2015.11.057 ↗
3. Analysis for relative motion in ultrasonic welding of aluminium sheet10.1179/1362171812Y.0000000066 ↗
4. Modeling of high-power ultrasonic welding of Cu/Al joint10.1007/s00170-018-2002-1 ↗
5. Hardening and softening in AlSi1 bond contacts during ultrasonic wire bonding10.1109/TCAPT.2008.2009930 ↗
6. Ultrasonic spot welding of aluminum alloys: A review10.1016/j.jmapro.2018.09.009 ↗
7. Mechanical stabilities of ultrasonic Al ribbon bonding on electroless nickel immersion gold finished Cu substrates10.7567/JJAP.53.069201 ↗
8. An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method10.1016/j.microrel.2018.05.013 ↗
9. Schwizer, J., Mayer, M., Bolliger, D., Paul, O., and Baltes, H. (1999, January 18–20). Thermosonic ball bonding: Friction model based on integrated microsensor measurements. Proceedings of the 24th IEEE/CPMT Int’l Electronics Manufacturing Technology Symposium, Austin, TX, USA.
10. Integrated temperature microsensors for characterization and optimization of thermosonic ball bonding process10.1109/6144.846780 ↗
11. Bonding mechanism in ultrasonic gold ball bonds on copper substrate10.1007/s11661-005-0220-2 ↗
12. Footprint study of ultrasonic wedge-bonding with aluminum wire on copper substrate10.1007/BF02690530 ↗
13. Numerical analysis of interfacial deformation and temperature rise during ultrasonic Al ribbon bonding10.1088/1742-6596/379/1/012028 ↗
14. Ultrasonic weldability of Al ribbon to Cu sheet and the dissimilar joint formation mode10.2320/matertrans.M2015251 ↗
15. Room temperature wedge-wedge ultrasonic bonding using aluminum coated copper wire10.1016/j.microrel.2010.08.001 ↗
16. A review on the mechanisms of ultrasonic wedge-wedge bonding10.1016/j.jmatprotec.2017.02.012 ↗
17. A footprint study of bond initiation in gold wire crescent bonding10.1109/TCAPT.2005.848585 ↗
18. Ultrasonic friction power in microelectronic wire bonding10.4028/www.scientific.net/MSF.539-543.3920 ↗
19. Influence of gold pick up on the hardness of copper free air ball10.1016/j.microrel.2010.03.014 ↗
20. Development of direct Al/Cu lead terminal ultrasonic bonding technology for power semiconductor chips
21. Evolution of interfacial shear force during ultrasonic Al ribbon bonding10.2320/matertrans.MD201207 ↗
22. Seppänen, H., Kaskela, A., Mustonen, K., Oinonen, M., and Hæggström, E. (2007, January 28–31). Understanding ultrasound-induced aluminum oxide breakage during wire bonding. Proceedings of the IEEE Ultrasonics Symposium, New York, NY, USA.10.1109/ULTSYM.2007.347 ↗
23. Analysis of the friction processes in ultrasonic wedge/wedge-bonding10.1007/s00542-009-0811-8 ↗
24. The ultrasonic wedge/wedge bonding process investigated using in situ real-time amplitudes from laser vibrometer and integrated force sensor10.1016/j.mee.2009.08.031 ↗
25. Ultrasonic friction power during thermosonic Au and Cu ball bonding10.1088/0022-3727/43/32/325301 ↗
26. Ultrasonic friction power during Al wire wedge-wedge bonding10.1063/1.3158065 ↗
27. Reduction of ultrasonic pad stress and aluminum splash in copper ball bonding10.1016/j.microrel.2010.06.002 ↗
28. Influence of tool edge angle on the bondability of alminum in ultrasonic bonding10.1016/j.jmatprotec.2017.08.024 ↗
29. Deformation behavior of thick aluminum wire during ultrasonic bonding10.2320/matertrans.MD201210 ↗
30. Investigation of ultrasonic vibrations of wire-bonding capillaries10.1016/j.mejo.2005.04.045 ↗
31. In situ observation of ultrasonic flip-chip bonding using high-speed camera10.7567/JJAP.54.030204 ↗
32. Real time contact resistance measurement to determine when microwelds start to form during ultrasonic wire bonding10.1016/j.mee.2012.12.003 ↗
33. Wire bonding quality monitoring via refining process of electrical signal from ultrasonic generator10.1016/j.ymssp.2010.09.010 ↗
34. Theoretical and numerical analysis of the effect of constant velocity on thermosonic bond strength10.1016/j.microrel.2007.10.001 ↗
35. Numerical analysis of the interfacial contact process in wire thermocompression bonding10.1109/95.506107 ↗
36. Numerical study of wire bonding—Analysis of interfacial deformation between wire and pad10.1115/1.1413765 ↗
37. A microslip model of the bonding process in ultrasonic wire bonders, part I: Transient response10.1007/s00170-005-2587-z ↗
38. A microslip model of the bonding process in ultrasonic wire bonders, part II: Steady state response10.1007/s00170-005-0006-0 ↗
39. Numerical and experimental analysis of thermosonic bond strength considering interfacial contact phenomena10.1088/0022-3727/41/16/165304 ↗
40. A study about atomic interaction at the interfaces of transient-metal/ceramics
41. Theory of metal-ceramic adhesion10.1016/0956-7151(94)00457-S ↗
42. Direct welding of different metals used ultrasonic vibration10.1016/j.jmatprotec.2008.03.006 ↗
43. Anomalous microstructure formed at the interface between copper ribbon and tin-deposited copper plate by ultrasonic bonding10.1016/j.microrel.2010.05.009 ↗
44. Interfacial microstructure between thick aluminium wires and aluminium alloy pads formed by ultrasonic bonding10.1179/1362171812Y.0000000088 ↗
45. Behavior of aluminum oxide intermetallics and voids in Cu–Al wire bonds10.1016/j.actamat.2011.05.041 ↗
46. Relation between vibration of wedge-tool and adhesion of wire to substrate during ultrasoinc bonding
47. Suzuki, J., Yamamoto, K., and Horita, M. (2018, January 30–31). The study of the load applied to the wire by ultrasonic vibration during wire bonding and bondability. Proceedings of the 24th Symposium on Microjoining and Assembly Technology in Electronics, Yokohama, Japan. Available online: http://sps-mste.jp/mate2018/src/images/2018_2nd.pdf.
48. Adhesional bonding of fine gold wires to metal substrates10.1163/156856103762864723 ↗
49. Stress induced diffusion along adhesional contact interfaces10.1016/S1359-6454(03)00015-6 ↗
50. Overview of wire bonding using copper wire or insulated wire10.1016/j.microrel.2010.06.003 ↗