Flexible Micro-Neural Interface Devices: Advances in Materials Integration and Scalable Manufacturing Technologies

Flexible microscale neural interfaces are advancing current strategies for recording and modulating electrical activity in the brain and spinal cord. The aim of this review is to colligate recent progress in thin-film micro-electrocorticography (μECoG) systems and establish a framework for their translation toward spinal bioelectronic implants. We first outline substrate and electrode material design, ranging from polymeric and hydrogel-based materials to nanostructured conductive materials that enable high-fidelity recording on mechanically compliant platforms. We then summarize structural design rules for μECoG arrays, including electrode size, pitch, and channel scaling, and relate these to data-driven μECoG applications in brain–computer interfaces and closed-loop neuromodulation. Bidirectional μECoG architectures for simultaneous stimulation and recording are examined, with emphasis on safe charge injection, electrochemical and thermal limits, and state-of-the-art hardware and algorithmic strategies for stimulation-artifact suppression. Building upon these cortical technologies, we briefly describe adaptation to spinal interfaces, where anatomical constraints demand optimized mechanical properties. Finally, we discuss the convergence of flexible bioelectronics, wireless power and telemetry, and embedded AI decoding as a path toward autonomous, clinically translatable μECoG and spinal neuroprosthetic systems. Ultimately, by synthesizing these multidisciplinary advances, this review provides a strategic roadmap for overcoming current translational barriers and realizing the full clinical potential of soft bioelectronics.