Effectiveness of Electrode Design Methodologies for Fast EDM Slotting of Thick Silicon Wafers

Silicon is the most commonly used material in the electronic industries due to its unique properties, which also make it very difficult to machine using conventional machining. Electrical discharge machining (EDM) is a non-traditional process that is gaining popularity for machining silicon, although a slower machining rate is one of its limitations. This study investigates two electrode design strategies to enhance the efficiency of EDM by improving the material removal rates, reducing tool wear, and refining the quality of machined features. The first approach involves using graphite electrodes in various array configurations (1 × 4 to 6 × 4) and leg heights (0.2″ and 0.3″). The second approach employs hollow electrodes with differing wall thicknesses (0.04″, 0.08″, and 0.12″). The effects of these variables on performance were evaluated by maintaining constant EDM parameters. The results indicate that increasing the number of electrode legs improves the flushing conditions, resulting in shorter machining times. Meanwhile, the shorter electrode height outperforms the taller electrode, providing a higher machining speed. The thinnest wall thickness for hollow electrodes yielded the best performance due to the increased energy distribution. Both electrode design methodologies can be used for the mass fabrication of features with targeted profiles on silicon using the die-sinking EDM process.