Effect of grain boundary failure on the fatigue life of high-lead SnPb soldersVaynman, S. and Fine, M.E. Scr. Metall. Mater. Sept. 1990 24, (9), 1737–1739

Abstract

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Research context

OpenAlex topics: Electronic Packaging and Soldering Technologies · Metal Forming Simulation Techniques · Metallurgy and Material Forming

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