Wafer-level perfect conformal contact lithography at the diffraction limit enabled by dry transferable photoresist

Abstract Lithography is a key enabling technique in modern micro/nano scale technology. Achieving the optimal trade-off between resolution, throughput, and cost remains a central focus in the ongoing development. However, current lithographic techniques such as direct-write, projection, and extreme ultraviolet lithography achieve higher resolution at the expense of increased complexity in optical systems or the use of shorter-wavelength light sources, thus raising the overall cost of production. Here, we present a cost-effective and wafer-level perfect conformal contact lithography at the diffraction limit. By leveraging a transferable photoresist, the technique ensures optimal contact between the mask and photoresist with zero-gap, facilitating the transfer of patterns at the diffraction limit while maintaining high fidelity and uniformity across large wafers. This technique applies to a wide range of complex surfaces, including non-conductive glass surfaces, flexible substrates, and curved surfaces. The proposed technique expands the potential of contact photolithography for novel device architectures and practical manufacturing processes.