Influence of Microstructure Coarsening on Thermomechanical Fatigue Behavior of Pb/Sn Eutectic Solder Joints
Source abstract
Abstract
The influence of microstructure coarsening on thermomechanical fatigue behavior of eutectic solder joint is investigated by numerical simulation. A phase growth model is selected based on the experimental observation and incorporated in a damage mechanics based viscoplastic constitutive model. Comparisons between the simulations with and without coarsening effect are made for isothermal, cyclic shear testing and thermal cycling of solder joints in BGA electronic packaging.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Metal Forming Simulation Techniques · Metallurgy and Material Forming
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Electronic Packaging Laboratory, 243 Ketter Hall, University at Buffalo, Buffalo, NY 14222-1095
References (45)
Show source-provided references
1. Adams, P. J., 1986, “Thermal Fatigue of Solder Joints in Micro-Electronic Devices,” M.S. Thesis, Department of Mechanical Engineering, MIT, Cambridge, MA.
2. Armstrong, P. J. and Frederick, C. O., 1966, “A Mathematical Representation of the Multiaxial Bauschinger Effect,” G.E.G.B. Report RD/B/N731.
3. 10.1115/1.279228410.1115/1.2792284 ↗
4. 10.1115/1.279228510.1115/1.2792285 ↗
5. 10.1016/S0307-904X(98)10059-810.1016/S0307-904X(98)10059-8 ↗
6. 10.1115/1.279265010.1115/1.2792650 ↗
7. Basaran, C. · 2001 · 1
8. 10.1106/HLB3-MJC8-JVYL-9A9P10.1106/HLB3-MJC8-JVYL-9A9P ↗
9. Basaran, C. · Int. J. of Damage Mechanics
10. 10.1061/(ASCE)0733-9399(1991)117:5(1070)10.1061/(ASCE)0733-9399(1991)117:5(1070) ↗
11. 10.1115/1.290418110.1115/1.2904181 ↗
12. 10.1016/0749-6419(89)90015-610.1016/0749-6419(89)90015-6 ↗
13. 10.1111/j.1460-2695.1988.tb01216.x10.1111/j.1460-2695.1988.tb01216.x ↗
14. Chow, C. L. · 1
15. 10.1007/BF0001727210.1007/BF00017272 ↗
16. 10.1115/1.290641210.1115/1.2906412 ↗
17. Frear, D. · 1994
18. 10.2172/48614810.2172/486148 ↗
19. Friedel, J. · 1964
20. Halford, G. R. · SAMPE Quarterly · 1983 · 14 · 17
21. 10.1016/0020-7683(89)90015-210.1016/0020-7683(89)90015-2 ↗
22. 10.1007/978-94-017-1957-510.1007/978-94-017-1957-5 ↗
23. 10.1016/0025-5416(81)90179-810.1016/0025-5416(81)90179-8 ↗
24. 10.1007/BF0055499910.1007/BF00554999 ↗
25. 10.1016/0167-6636(89)90011-210.1016/0167-6636(89)90011-2 ↗
26. Lemaitre, J. · 1990
27. MarSn, J. W. · 1976
28. 10.1115/1.317367310.1115/1.3173673 ↗
29. 10.1520/STP23915S10.1520/STP23915S ↗
30. 10.1007/978-1-4615-3910-0_710.1007/978-1-4615-3910-0_7 ↗
31. Morris, J. W. · 1992 · 1529
32. 10.1115/1.279267910.1115/1.2792679 ↗
33. Rabotnov, Y. N. · 1969
34. Sayama, T. · 1999 · 581
35. 10.1016/0001-6160(62)90058-510.1016/0001-6160(62)90058-5 ↗
36. Smithells, C. J. · 1983
37. 10.1109/TCHMT.1986.113667210.1109/TCHMT.1986.1136672 ↗
38. Solomon, H. D. · Brazing and Soldering · 1986 · 11 · 68
39. 10.1115/1.322652510.1115/1.3226525 ↗
40. 10.1115/1.279213410.1115/1.2792134 ↗
41. Vaynman, S. · 1991
42. Valanis, K. C. · Arch. Mech. · 1997 · 49 · 443
43. 10.1016/S0922-5382(96)80007-910.1016/S0922-5382(96)80007-9 ↗
44. 10.1515/JMBM.1999.10.3.13510.1515/JMBM.1999.10.3.135 ↗
45. 10.1016/S0167-6636(99)00053-810.1016/S0167-6636(99)00053-8 ↗